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SN75C1406NS

Texas Instruments

SN75C1406NS by Texas Instruments

SN75C1406NS by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 5V with a max supply voltage of 15V. It features Schmitt Trigger input characteristics and is ideal for EIA-232-F, TIA-232-F, V.28 interface standards in commercial temperature grade applications.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,937 parts In-Stock

1+ parts

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3,937

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Digiode

USA . 3,069 parts In-Stock

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3,069

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Resion

USA . 80 parts In-Stock

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80

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Distributors (Availability)

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AZTECH Wire

Italy . 778 parts In-Stock

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$5.769

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778

$5.769

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Parana Technologies

USA . 893 parts In-Stock

1+ parts

$12.914

100+ parts

$1,199.252

1k+ parts

$11.623

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-

893

$12.914

$1,199.252

$11.623

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DigiPath Technology Company

USA . 435 parts In-Stock

1+ parts

$14.220

100+ parts

$13.082

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435

$14.220

$13.082

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ChromeModa Solutions

Germany . 4,716 parts In-Stock

1+ parts

$14.510

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$11.898

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4,716

$14.510

$11.898

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IDEA Electronic Components Group

UK . 1,900 parts In-Stock

1+ parts

$14.510

100+ parts

$13.784

1k+ parts

$13.059

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1,900

$14.510

$13.784

$13.059

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One Stop Electronics

USA . 1,331 parts In-Stock

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$29.500

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Corphita

USA . 2,508 parts In-Stock

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Microchip USA

USA . 1,538 parts In-Stock

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Overview

Elevate your electronic projects with the SN75C1406NS by Texas Instruments, a top-of-the-line line driver and receiver that delivers unparalleled quality and reliability. Manufactured by the esteemed Texas Instruments, this product offers cutting-edge technology and superior performance for a wide range of applications. With its small outline package style and dual terminal position, this device is designed for ease of use and seamless integration into your projects. Experience the value and benefits of the SN75C1406NS today, and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and reliability are important factors.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 6 V

With a maximum supply voltage of 6V, this product can interface with a wide range of systems and devices without the risk of overloading.

No. of Functions: 3

The multiple functions provided by this product offer flexibility in applications and reduce the need for additional components, simplifying overall design.

Maximum Transmit Delay: 3500 ns

The low transmit delay ensures efficient data transfer and minimal latency in communication systems, making it suitable for high-speed applications.

Maximum Supply Voltage-1: 15 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, increasing versatility in system integration.

Power Supplies (V): 5,+-4.5/+-15

The multiple power supply options cater to different voltage requirements in diverse applications, providing flexibility and compatibility with various systems.

No. of Terminals: 16

The ample number of terminals enable easy connectivity and integration with other components, facilitating seamless operation within a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, important for compact designs and applications where board real estate is limited.

Maximum High Level Input Current: 0.000001 Amp

The low high-level input current requirement reduces power consumption and enables efficient operation, making it suitable for battery-powered devices.

Maximum Seated Height: 2 mm

The low seated height of 2mm allows for a compact overall profile, ideal for applications with strict height restrictions or space limitations.

Technical Specifications

Line Drivers & Receivers SN75C1406NS attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-12 V

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

8 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,+-4.5/+-15

Qualification:

Not Qualified

Maximum Receive Delay:

4000 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

15 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Technology:

BIMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3500 ns

Width:

5.3 mm

Trade Compliance

SN75C1406NS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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