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SN75ALS181N

Texas Instruments

SN75ALS181N by Texas Instruments

LINE TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.412

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,092 parts In-Stock

1+ parts

$1.370

100+ parts

$1.340

1k+ parts

$1.320

10k+ parts

-

3,092

$1.370

$1.340

$1.320

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Avnet

USA . 175 parts In-Stock

1+ parts

-

100+ parts

-

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$1.453

10k+ parts

$1.381

175

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-

$1.453

$1.381

Distributors (In-Stock)

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Vyrian

USA . 5,258 parts In-Stock

1+ parts

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5,258

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Digiode

USA . 1,430 parts In-Stock

1+ parts

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1,430

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Cyclops Electronics Ltd

UK . 175 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 146 parts In-Stock

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Bristol Electronics

USA . 105 parts In-Stock

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Atlantic Semiconductor

USA . 105 parts In-Stock

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Inventory MP

USA . 7 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,859 parts In-Stock

1+ parts

$8.620

100+ parts

-

1k+ parts

$9.288

10k+ parts

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1,859

$8.620

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$9.288

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One Stop Electronics

USA . 814 parts In-Stock

1+ parts

$9.500

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814

$9.500

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ChromeModa Solutions

Germany . 3,641 parts In-Stock

1+ parts

$9.685

100+ parts

$7.942

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3,641

$9.685

$7.942

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IDEA Electronic Components Group

UK . 428 parts In-Stock

1+ parts

$9.685

100+ parts

$9.201

1k+ parts

$8.716

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428

$9.685

$9.201

$8.716

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AZTECH Wire

Italy . 844 parts In-Stock

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$16.084

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844

$16.084

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Lixinc

USA . 19,414 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Corphita

USA . 4,172 parts In-Stock

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Perfect Parts

USA . 1,452 parts In-Stock

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1,452

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DigiPath Technology Company

USA . 353 parts In-Stock

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$8.732

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353

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$8.732

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Microchip USA

USA . 256 parts In-Stock

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256

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Cyclops Electronics Ltd (Excess)

UK . 146 parts In-Stock

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Assy Fe

Spain . 119 parts In-Stock

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Kepictronics

USA . 117 parts In-Stock

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Glotronic Ltd.

UK . 117 parts In-Stock

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Technical Specifications

Line Drivers & Receivers SN75ALS181N attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.10; V.11; X.26; X.27

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

1

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

20 ns

Width:

7.62 mm

Trade Compliance

SN75ALS181N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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