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SN75477DG4

Texas Instruments

SN75477DG4 by Texas Instruments

SN75477DG4 by Texas Instruments is a peripheral driver with 2 functions, operating at 5V. It features open-collector output polarity and built-in transient protection. Ideal for applications requiring inverted output flow direction and standard input characteristics in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,787 parts In-Stock

1+ parts

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5,787

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Digiode

USA . 3,158 parts In-Stock

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3,158

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,383 parts In-Stock

1+ parts

$3.063

100+ parts

$284.481

1k+ parts

$2.757

10k+ parts

-

1,383

$3.063

$284.481

$2.757

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DigiPath Technology Company

USA . 158 parts In-Stock

1+ parts

$3.373

100+ parts

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158

$3.373

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ChromeModa Solutions

Germany . 3,295 parts In-Stock

1+ parts

$3.442

100+ parts

$2.822

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3,295

$3.442

$2.822

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IDEA Electronic Components Group

UK . 1,287 parts In-Stock

1+ parts

$3.442

100+ parts

-

1k+ parts

$3.098

10k+ parts

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1,287

$3.442

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$3.098

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AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$5.772

100+ parts

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241

$5.772

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One Stop Electronics

USA . 182 parts In-Stock

1+ parts

$29.500

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182

$29.500

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Corphita

USA . 4,358 parts In-Stock

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4,358

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Microchip USA

USA . 1,893 parts In-Stock

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1,893

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Overview

Unlock the potential of your electronic devices with the SN75477DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality peripheral drivers like this one that offer reliability and durability. Ideal for a wide range of applications, this product provides inverted output polarity and built-in transient protections, ensuring seamless performance. With a maximum supply voltage of 5.5V and maximum output current of 0.5A, the SN75477DG4 is designed to meet your needs. Trust Texas Instruments for cutting-edge technology and superior products that add value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the peripheral driver, making it suitable for long-term use.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, ensuring a stable connection.

Maximum Supply Voltage: 5.5 V

Can handle a relatively high supply voltage, making it versatile for different applications.

No. of Functions: 2

Having multiple functions in one device saves space on the circuit board and simplifies the design.

Package Shape: RECTANGULAR

The compact rectangular shape makes it easy to integrate into various electronic systems.

Built-in Protections: TRANSIENT

Provides protection against transient voltage spikes, increasing the reliability of the peripheral driver.

Power Supplies (V): 5

Operates on a standard 5V power supply, compatible with many electronic devices.

No. of Terminals: 8

Having multiple terminals allows for versatile connectivity options with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB and makes the assembly process easier.

Minimum Supply Voltage: 4.5 V

Can operate efficiently even with a slightly lower supply voltage, providing flexibility in power sources.

Maximum Operating Temperature: 70 °C

Able to withstand high temperatures, suitable for use in various environmental conditions.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with other components and devices.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The finish provides corrosion resistance and ensures a reliable connection between terminals.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in mounting and connection options.

Maximum Seated Height: 1.75 mm

The low profile design minimizes the overall height of the peripheral driver, saving space in the system.

Width: 3.9 mm

Compact width allows for easy integration into tight spaces on the circuit board.

Output Polarity: INVERTED

The inverted output polarity is suitable for certain applications where this functionality is required.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during the manufacturing process, ensuring reliable solder joints.

Length: 4.9 mm

The short length of the peripheral driver saves space on the PCB and simplifies the layout.

Temperature Grade: COMMERCIAL

Designed for standard commercial temperature ranges, suitable for most commercial electronic devices.

Maximum Output Current: 0.5 A

Capable of driving up to 0.5A of current, suitable for driving various loads.

Technology: BIPOLAR

Bipolar technology offers good efficiency and performance for the peripheral driver.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process and ensures a secure connection.

Maximum Supply Current: 75 mA

Operates with a low supply current, minimizing power consumption and heat generation.

Input Characteristics: STANDARD

Standard input characteristics make it compatible with a wide range of control signals.

Nominal Supply Voltage: 5 V

Operates at the commonly used 5V supply voltage, making it easy to integrate into existing systems.

Turn-on Time: 0.35 us

Fast turn-on time ensures quick response and performance of the peripheral driver.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy integration into standard PCB layouts.

Driver No. of Bits: 2

Having 2 bits allows for driving multiple output states, providing flexibility in control.

Nominal Output Peak Current Limit: 3 A

Capable of handling peak output currents up to 3A, suitable for driving high-current loads.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type offers versatility in interfacing with different control signals.

Turn-off Time: 0.35 us

Fast turn-off time ensures quick response and efficient operation of the peripheral driver.

Output Current Flow Direction: SINK

The sink output current flow direction allows for efficient current handling and control.

Technical Specifications

Peripheral Drivers SN75477DG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

2

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

3 A

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

.35 us

Turn-on Time:

.35 us

Width:

3.9 mm

Trade Compliance

SN75477DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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