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SN751177NSRG4

Texas Instruments

SN751177NSRG4 by Texas Instruments

SN751177NSRG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 5V. It offers differential output, EIA-422-B interface standard, and operates in temperatures ranging from -20 to 85°C. Ideal for applications requiring fast transmit delay of 25ns and receive delay of 35ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,694 parts In-Stock

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5,694

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Chip Stock

USA . 5,000 parts In-Stock

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5,000

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Digiode

USA . 4,370 parts In-Stock

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4,370

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ComSIT USA

USA . 564 parts In-Stock

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ComSIT Distribution GmbH

Germany . 564 parts In-Stock

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564

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Nova Conductors

Japan . 63 parts In-Stock

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63

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Parana Technologies

USA . 308 parts In-Stock

1+ parts

$2.445

100+ parts

$227.040

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$2.200

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308

$2.445

$227.040

$2.200

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DigiPath Technology Company

USA . 615 parts In-Stock

1+ parts

$2.692

100+ parts

$2.477

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615

$2.692

$2.477

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IDEA Electronic Components Group

UK . 93 parts In-Stock

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$2.747

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$2.472

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93

$2.747

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ChromeModa Solutions

Germany . 17 parts In-Stock

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$2.747

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$2.253

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$2.747

$2.253

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Corohmni

South Africa . 184 parts In-Stock

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$7.625

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AZTECH Wire

Italy . 723 parts In-Stock

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$15.478

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Ampacity Inc.

Singapore . 1,324 parts In-Stock

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$16.500

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One Stop Electronics

USA . 1,252 parts In-Stock

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$35.500

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Continental Prestige Electronics

USA . 5,957 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,285 parts In-Stock

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Argo Parts USA

USA . 1,985 parts In-Stock

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Microchip USA

USA . 1,627 parts In-Stock

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Corphita

USA . 899 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Elevate your electronics with the SN751177NSRG4 from Texas Instruments, a top-tier manufacturer known for superior quality and reliability. As a leading player in the Line Drivers & Receivers category, this product offers unmatched performance and versatility. With its advanced technology and innovative design, the SN751177NSRG4 delivers seamless connectivity and efficient data transmission. Experience the value and benefits of this exceptional product, designed to meet all your needs with precision and excellence. Trust Texas Instruments for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

This surface mount capability allows for easy and efficient installation, saving time and effort during assembly processes.

Maximum Supply Voltage: 5.25 V

With a maximum supply voltage of 5.25V, this product is suitable for high-power applications where stable voltage output is crucial.

No. of Functions: 2

Offering multiple functions in one device provides cost efficiency and space-saving benefits in electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration and placement in various electronic systems.

Maximum Transmit Delay: 25 ns

The low maximum transmit delay ensures fast and efficient data transmission, making it ideal for real-time applications.

Power Supplies (V): 5

With a power supply of 5V, this product is compatible with standard voltage requirements, making it versatile for a range of applications.

No. of Terminals: 16

The high number of terminals allows for versatile connectivity options, making it suitable for complex electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and provides flexibility in designing compact electronic devices.

Minimum Supply Voltage-1: 4.75 V

This low minimum supply voltage ensures reliable operation even under varying voltage conditions, enhancing the product's stability.

Technical Specifications

Line Drivers & Receivers SN751177NSRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

TRISTATABLE RECEIVERS

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.10; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

.02 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

25 ns

Width:

5.3 mm

Trade Compliance

SN751177NSRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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