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SN74LVC2G53DCUTG4

Texas Instruments

SN74LVC2G53DCUTG4 by Texas Instruments

SN74LVC2G53DCUTG4 by Texas Instruments is a CMOS dual single-ended multiplexer with 8 terminals, operating at temperatures from -40 to 85°C. It has a max on-state resistance of 30 ohms and can handle a signal current of up to 0.1A. This small-outline switch is ideal for industrial applications requiring common output switching functions.

Median Price

$0.944

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 98,950 parts In-Stock

1+ parts

$0.944

100+ parts

$0.642

1k+ parts

$0.329

10k+ parts

-

98,950

$0.944

$0.642

$0.329

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,482 parts In-Stock

1+ parts

$0.897

100+ parts

-

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-

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3,482

$0.897

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Vyrian

USA . 7,331 parts In-Stock

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-

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7,331

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North Shore Components

USA . 737 parts In-Stock

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737

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,955 parts In-Stock

1+ parts

$0.850

100+ parts

-

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4,955

$0.850

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Parana Technologies

USA . 1,298 parts In-Stock

1+ parts

$8.191

100+ parts

-

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$8.801

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-

1,298

$8.191

-

$8.801

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DigiPath Technology Company

USA . 1,728 parts In-Stock

1+ parts

$9.019

100+ parts

$8.297

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-

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-

1,728

$9.019

$8.297

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ChromeModa Solutions

Germany . 6,224 parts In-Stock

1+ parts

$9.203

100+ parts

$7.546

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-

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6,224

$9.203

$7.546

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IDEA Electronic Components Group

UK . 754 parts In-Stock

1+ parts

$9.203

100+ parts

$8.743

1k+ parts

$8.283

10k+ parts

-

754

$9.203

$8.743

$8.283

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AZTECH Wire

Italy . 1,028 parts In-Stock

1+ parts

$21.100

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1,028

$21.100

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Microchip USA

USA . 1,495 parts In-Stock

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1,495

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Overview

Unlock the power of seamless signal switching with the SN74LVC2G53DCUTG4 by Texas Instruments. Crafted with precision and reliability in mind, this multiplexer is a game-changer in the field of electronics. Whether you're designing cutting-edge consumer electronics or industrial automation systems, this versatile device offers unparalleled performance and efficiency. Say goodbye to signal interference and hello to smooth operation with the SN74LVC2G53DCUTG4. Make the smart choice for your projects and experience the difference that Texas Instruments can bring to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 1.8/5

Support for multiple power supplies allows for flexible usage in different electrical setups.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for various devices or components.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The small outline and thin profile design with shrink pitch saves space on the circuit board and enables compact device designs.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages.

Technical Specifications

Multiplexers & Switches SN74LVC2G53DCUTG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

300 kHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

COMMON OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Maximum Signal Current:

.1 A

Sub-Category:

Multiplexers or Switches

Maximum Supply Current (Isup):

.01 mA

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

SN74LVC2G53DCUTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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