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SN74LVC157ADE4

Texas Instruments

SN74LVC157ADE4 by Texas Instruments

SN74LVC157ADE4 by Texas Instruments is a 4-function, 2-input multiplexer with a propagation delay of 6.4 ns at 1.8V supply voltage. It operates in industrial temperature range (-40 to 85°C) and has a max power supply current of 0.04 mA, making it suitable for various digital applications requiring fast switching speeds and low power consumption.

Median Price

$0.635

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 880 parts In-Stock

1+ parts

-

100+ parts

$0.635

1k+ parts

$0.527

10k+ parts

$0.470

880

-

$0.635

$0.527

$0.470

DigiKey

USA . 880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.600

10k+ parts

-

880

-

-

$0.600

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Verical

USA . 880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.659

10k+ parts

$0.587

880

-

-

$0.659

$0.587

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,034 parts In-Stock

1+ parts

$0.548

100+ parts

-

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1,034

$0.548

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Vyrian

USA . 6,271 parts In-Stock

1+ parts

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6,271

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DigiKey Marketplace

USA . 880 parts In-Stock

1+ parts

-

100+ parts

$0.600

1k+ parts

-

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880

-

$0.600

-

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ACDS - Activité Composants Distribution Service

France . 13 parts In-Stock

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,176 parts In-Stock

1+ parts

$0.519

100+ parts

-

1k+ parts

-

10k+ parts

-

3,176

$0.519

-

-

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Component Stockers USA

USA . 1,599 parts In-Stock

1+ parts

$0.590

100+ parts

$0.550

1k+ parts

-

10k+ parts

-

1,599

$0.590

$0.550

-

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Parana Technologies

USA . 1,085 parts In-Stock

1+ parts

$17.444

100+ parts

-

1k+ parts

$17.644

10k+ parts

-

1,085

$17.444

-

$17.644

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DigiPath Technology Company

USA . 1,242 parts In-Stock

1+ parts

$19.208

100+ parts

$17.671

1k+ parts

-

10k+ parts

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1,242

$19.208

$17.671

-

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IDEA Electronic Components Group

UK . 1,121 parts In-Stock

1+ parts

$19.600

100+ parts

$18.620

1k+ parts

$17.640

10k+ parts

-

1,121

$19.600

$18.620

$17.640

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ChromeModa Solutions

Germany . 699 parts In-Stock

1+ parts

$19.600

100+ parts

$16.072

1k+ parts

-

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699

$19.600

$16.072

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Kepictronics

USA . 2,881 parts In-Stock

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2,881

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Microchip USA

USA . 1,722 parts In-Stock

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1,722

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Perfect Parts

USA . 69 parts In-Stock

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69

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Cyclops Electronics Ltd (Excess)

UK . 31 parts In-Stock

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31

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Overview

Unlock seamless data processing with the Texas Instruments SN74LVC157ADE4 Multiplexer & Demultiplexer. Manufactured with top-tier quality, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile component provides customers with value, efficiency, and precision. Experience the advantages of Texas Instruments technology in a compact and powerful package, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6.4 ns

Low propagation delay allows for faster data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation easier and more convenient, especially in compact electronic devices.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, saving space and cost.

No. of Inputs: 2

Having multiple inputs allows for versatile input configurations and signal routing options.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a lower voltage can lead to energy efficiency and reduced power consumption.

Propagation Delay (tpd): 14 ns

Low propagation delay ensures minimal signal distortion and accurate data transmission.

Technology: CMOS

CMOS technology offers high-speed performance, low power consumption, and compatibility with a wide range of devices.

Technical Specifications

Multiplexer & Demultiplexer SN74LVC157ADE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LVC157ADE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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