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SN74HC273QDWRQ1

Texas Instruments

SN74HC273QDWRQ1 by Texas Instruments

SN74HC273QDWRQ1 by Texas Instruments is an 8-bit latch with a supply voltage of 2-6V, operating at frequencies up to 18MHz. It features a propagation delay of 240ns, suitable for automotive applications due to AEC-Q100 screening and a temperature range of -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,822 parts In-Stock

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Digiode

USA . 1,694 parts In-Stock

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1,694

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Distributors (Availability)

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Parana Technologies

USA . 136 parts In-Stock

1+ parts

$13.383

100+ parts

-

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$13.901

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136

$13.383

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$13.901

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DigiPath Technology Company

USA . 880 parts In-Stock

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$14.736

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880

$14.736

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ChromeModa Solutions

Germany . 1,805 parts In-Stock

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$15.037

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$12.330

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1,805

$15.037

$12.330

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IDEA Electronic Components Group

UK . 1,421 parts In-Stock

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$15.037

100+ parts

$14.285

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$13.533

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1,421

$15.037

$14.285

$13.533

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AZTECH Wire

Italy . 521 parts In-Stock

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$17.788

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521

$17.788

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One Stop Electronics

USA . 1,589 parts In-Stock

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$36.000

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$36.000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,072 parts In-Stock

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Corphita

USA . 1,420 parts In-Stock

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Microchip USA

USA . 203 parts In-Stock

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Overview

Unlock the potential of your automotive electronics with the SN74HC273QDWRQ1 by Texas Instruments. Built with quality and reliability in mind, this latches & flip-flops device offers a seamless integration into your systems, providing precise and efficient operation. From controlling signals to managing data storage, this product ensures optimal performance at all times. With its AEC-Q100 screening level and wide temperature range, rest assured that your applications will run smoothly under any conditions. Trust Texas Instruments to deliver cutting-edge solutions that bring value and innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making the latch or flip-flop suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability, making this product ideal for automotive applications where robustness is crucial.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common and widely used standard in many electronic systems, ensuring compatibility with existing setups.

Propagation Delay (tpd): 240 ns

The low propagation delay of 240 nanoseconds ensures fast and efficient operation, making this latch or flip-flop suitable for high-speed applications.

Technical Specifications

Latches & Flip-Flops SN74HC273QDWRQ1 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

18000000 Hz

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

21 MHz

Trade Compliance

SN74HC273QDWRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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