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SN74HC259DRE4

Texas Instruments

SN74HC259DRE4 by Texas Instruments

SN74HC259DRE4 by Texas Instruments is an 8-bit latch with a propagation delay of 28ns at 5V. It operates in industrial temperatures, has a max supply voltage of 6V, and low-level trigger type. Ideal for applications requiring fast data storage and retrieval in compact electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,209 parts In-Stock

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Digiode

USA . 2,681 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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AZTECH Wire

Italy . 351 parts In-Stock

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$5.072

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Corohmni

South Africa . 361 parts In-Stock

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$18.658

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$18.658

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Ampacity Inc.

Singapore . 1,418 parts In-Stock

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$27.000

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Parana Technologies

USA . 2,312 parts In-Stock

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$29.799

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$63.349

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$29.799

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$63.349

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DigiPath Technology Company

USA . 2,281 parts In-Stock

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$32.812

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ChromeModa Solutions

Germany . 3,769 parts In-Stock

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$33.482

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$27.455

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IDEA Electronic Components Group

UK . 1,268 parts In-Stock

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$33.482

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$31.808

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$30.134

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One Stop Electronics

USA . 1,225 parts In-Stock

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$55.000

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Corphita

USA . 4,047 parts In-Stock

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Argo Parts USA

USA . 2,648 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

USA . 958 parts In-Stock

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the high-quality SN74HC259DRE4 latch and flip-flop from Texas Instruments. Designed for reliability and efficiency, this versatile component offers a wide range of applications in various industries. With a focus on performance and durability, Texas Instruments delivers exceptional value to customers seeking top-notch components for their projects. Experience seamless integration and enhanced functionality with the SN74HC259DRE4, setting new standards for quality and innovation in the field of latches and flip-flops.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and resistant to environmental factors, making the product reliable for various applications.

Propagation Delay At Nominal Supply: 28 ns

Low propagation delay ensures fast response times, making this latch or flip-flop suitable for high-speed operations.

Surface Mount: YES

Surface mount capability makes installation easier and more compact, ideal for space-constrained designs.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and efficient use of space.

No. of Bits: 8

8-bit design provides functionality for handling multiple data inputs and outputs, suitable for complex applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V voltage makes integration with existing systems simpler and more compatible.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable performance and reliable operation in different circuit configurations.

Power Supplies (V): 2/6

Support for a range of power supplies allows flexibility in design and compatibility with various voltage levels.

No. of Terminals: 16

Sufficient terminals provide connectivity options for input, output, and power, ensuring versatile use in different configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and enables compact designs.

Maximum I (ol): 5.2 Amp

High output current capacity allows for driving larger loads, making the product suitable for industrial applications.

Propagation Delay (tpd): 165 ns

Reasonable propagation delay ensures reliable signal transmission and reception, crucial for error-free operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the product suitable for harsh environmental conditions and industrial applications.

Trigger Type: LOW LEVEL

Low-level trigger type ensures compatibility with various input signal levels, improving usability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures functionality in cold environments, increasing the product's versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides reliable electrical connections and resistance to corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout and ease of connectivity, enhancing usability.

Maximum Seated Height: 1.75 mm

Low seated height reduces the overall profile of the product, making it suitable for compact designs and applications with space constraints.

Width: 3.91 mm

Compact width allows for efficient use of space on the circuit board and supports tight layout requirements.

Output Polarity: TRUE

True output polarity ensures correct signal representation, enhancing compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage allows for operation in low-power environments, improving energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time ensures proper soldering during assembly, reducing the risk of soldering defects and ensuring product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables reliable soldering and assembly processes, ensuring product quality and longevity.

Length: 9.9 mm

Optimal length provides a balance between compactness and usability, making the product suitable for various design requirements.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions, making the product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the overall performance of the product.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections, improving electrical conductivity and product reliability.

Packing Method: TR

TR packing method ensures ease of handling and storage, making it convenient for manufacturers and users alike.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easy integration into circuit designs and supports compatibility with industry-standard layouts.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage tolerance allows for flexibility in power supply options and compatibility with various voltage levels.

Maximum Power Supply Current (ICC): 0.08 mA

Low power supply current consumption ensures energy efficiency and minimizes heat dissipation, making the product suitable for low-power applications.

Technical Specifications

Latches & Flip-Flops SN74HC259DRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH

Family:

HC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

165 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

3.91 mm

Trade Compliance

SN74HC259DRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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