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SN74HC174PWRG4

Texas Instruments

SN74HC174PWRG4 by Texas Instruments

SN74HC174PWRG4 by Texas Instruments is a 6-bit latches & flip-flops IC with a propagation delay of 40ns. It operates at a nominal voltage of 5V and has a max frequency of 25MHz. This CMOS technology chip is ideal for industrial applications requiring positive edge triggering in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 39,450 parts In-Stock

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Vyrian

USA . 8,592 parts In-Stock

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Digiode

USA . 3,602 parts In-Stock

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Parana Technologies

USA . 1,052 parts In-Stock

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$8.673

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$9.352

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$8.673

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DigiPath Technology Company

USA . 2,104 parts In-Stock

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$9.550

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$9.550

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ChromeModa Solutions

Germany . 3,891 parts In-Stock

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$9.745

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$7.991

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IDEA Electronic Components Group

UK . 2,158 parts In-Stock

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$9.745

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$9.258

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$8.770

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One Stop Electronics

USA . 599 parts In-Stock

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$13.000

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$13.000

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AZTECH Wire

Italy . 254 parts In-Stock

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$13.933

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Component Stockers USA

USA . 260 parts In-Stock

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$99.990

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Microchip USA

USA . 2,508 parts In-Stock

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Corphita

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Overview

Discover the superior quality and reliability of the SN74HC174PWRG4 by Texas Instruments, a leading manufacturer in the industry. This versatile latch & flip-flop component boasts a multitude of applications, making it an essential choice for various projects. With a nominal supply voltage of 5V and fast propagation delay, this product offers unmatched performance and efficiency. Trust in Texas Instruments to deliver top-notch products that meet your needs and exceed your expectations. Experience the value and benefits of the SN74HC174PWRG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 40 ns

The fast propagation delay of 40 ns ensures quick response times and efficient operation of the latch or flip-flop.

Surface Mount: YES

Being surface mountable makes installation and mounting of the latch or flip-flop easier and more convenient.

No. of Bits: 6

Having 6 bits allows for storing and processing a larger amount of data in the latch or flip-flop.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources and systems.

Technology: CMOS

The CMOS technology used in the latch or flip-flop provides low power consumption and high noise immunity, making it an efficient and reliable choice.

Maximum Frequency At Nominal Supply: 25000000 Hz

The high maximum frequency capability of 25 MHz allows for fast operation and processing speed in the latch or flip-flop.

Technical Specifications

Latches & Flip-Flops SN74HC174PWRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

40 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

29 MHz

Trade Compliance

SN74HC174PWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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