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SN74AVCA406EZQSR

Texas Instruments

SN74AVCA406EZQSR by Texas Instruments

SN74AVCA406EZQSR by Texas Instruments is a Line Transceiver IC with 24 terminals, operating at supply voltages of 1.2-3.6V. It features a max transmit delay of 7.7ns and output characteristics in 3-STATE mode, suitable for industrial applications requiring fast signal transmission and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,720 parts In-Stock

1+ parts

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5,720

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Digiode

USA . 522 parts In-Stock

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522

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Nova Conductors

Japan . 53 parts In-Stock

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53

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Distributors (Availability)

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One Stop Electronics

USA . 923 parts In-Stock

1+ parts

$5.500

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923

$5.500

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Parana Technologies

USA . 116 parts In-Stock

1+ parts

$6.444

100+ parts

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$7.187

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116

$6.444

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$7.187

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DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$7.096

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2,200

$7.096

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ChromeModa Solutions

Germany . 4,950 parts In-Stock

1+ parts

$7.241

100+ parts

$5.938

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4,950

$7.241

$5.938

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IDEA Electronic Components Group

UK . 2,358 parts In-Stock

1+ parts

$7.241

100+ parts

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$6.517

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2,358

$7.241

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$6.517

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AZTECH Wire

Italy . 359 parts In-Stock

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$11.971

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359

$11.971

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Ampacity Inc.

Singapore . 481 parts In-Stock

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$16.500

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481

$16.500

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A-Z Elektronik GmbH

Germany . 6,818 parts In-Stock

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6,818

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,854 parts In-Stock

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1,854

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

USA . 186 parts In-Stock

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186

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Overview

Enhance your electronic projects with the high-quality SN74AVCA406EZQSR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Line Drivers & Receivers that offer superior performance and reliability. This versatile component is perfect for a wide range of applications, providing customers with exceptional value and benefits. Trust Texas Instruments to provide innovative solutions for all your circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes it easy to incorporate into electronic circuits and reduces assembly time.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in design and compatibility with various systems.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board.

Maximum Transmit Delay: 7.7 ns

Low transmit delay ensures fast and efficient data transmission.

Power Supplies (V): 1.2/3.6

Ability to operate within a range of power supplies offers versatility in different applications.

No. of Terminals: 24

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch makes it suitable for compact electronic devices.

Minimum Supply Voltage: 1.2 V

Can operate at low supply voltages, making it energy efficient.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in various environments.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the output signal.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without issue.

Terminal Finish: TIN SILVER COPPER

Terminal finish provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position makes it easier for PCB layout and assembly.

Maximum Seated Height: 1 mm

Low seated height enables a compact design overall.

Width: 3 mm

Narrow width makes it suitable for space-constrained applications.

Maximum Output Low Current: 0.08 Amp

Can handle higher output currents, suitable for driving loads.

Output Polarity: TRUE

True output polarity ensures correct signal transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for lead-free soldering processes.

Length: 3 mm

Compact length for space-efficient design.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide temperature range.

Maximum Receive Delay: 7.7 ns

Low receive delay ensures fast and accurate data reception.

Terminal Form: BALL

Ball terminal form for reliable solder joints and connectivity.

Maximum Supply Current: 0.02 mA

Low supply current for energy efficiency.

Input Characteristics: STANDARD

Standard input characteristics for compatibility with various systems.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage for stable operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface for efficient data communication.

Technical Specifications

Line Drivers & Receivers SN74AVCA406EZQSR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B24

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

.08 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6

Qualification:

Not Qualified

Maximum Receive Delay:

7.7 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.02 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

1.2 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

7.7 ns

Width:

3 mm

Trade Compliance

SN74AVCA406EZQSR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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