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SN65MLVD204BD

Texas Instruments

SN65MLVD204BD by Texas Instruments

SN65MLVD204BD by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 3.5ns max transmit delay, and 10ns max receive delay. Ideal for industrial applications requiring EIA-899/TIA-899 interface standard compliance and differential Schmitt trigger input characteristics.

Median Price

$1.864

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 17 parts In-Stock

1+ parts

$1.509

100+ parts

$1.412

1k+ parts

$1.349

10k+ parts

$1.331

17

$1.509

$1.412

$1.349

$1.331

Texas Instruments

USA . 2,536 parts In-Stock

1+ parts

$2.218

100+ parts

$1.943

1k+ parts

$1.098

10k+ parts

-

2,536

$2.218

$1.943

$1.098

-

Mouser Electronics

USA . 893 parts In-Stock

1+ parts

$4.860

100+ parts

$2.290

1k+ parts

-

10k+ parts

-

893

$4.860

$2.290

-

-

Chip1Stop

Japan . 225 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

-

10k+ parts

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225

-

$1.320

-

-

Verical

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

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-

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17

-

-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,209 parts In-Stock

1+ parts

$1.434

100+ parts

-

1k+ parts

-

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1,209

$1.434

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.775

100+ parts

-

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-

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-

300

$1.775

-

-

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Vyrian

USA . 7,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,141

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 426 parts In-Stock

1+ parts

$1.120

100+ parts

-

1k+ parts

-

10k+ parts

-

426

$1.120

-

-

-

Corphita

USA . 132 parts In-Stock

1+ parts

$1.358

100+ parts

-

1k+ parts

-

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132

$1.358

-

-

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Parana Technologies

USA . 513 parts In-Stock

1+ parts

$13.216

100+ parts

-

1k+ parts

$13.721

10k+ parts

-

513

$13.216

-

$13.721

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DigiPath Technology Company

USA . 1,797 parts In-Stock

1+ parts

$14.552

100+ parts

-

1k+ parts

-

10k+ parts

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1,797

$14.552

-

-

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ChromeModa Solutions

Germany . 1,276 parts In-Stock

1+ parts

$14.849

100+ parts

$12.176

1k+ parts

-

10k+ parts

-

1,276

$14.849

$12.176

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-

IDEA Electronic Components Group

UK . 454 parts In-Stock

1+ parts

$14.849

100+ parts

$14.107

1k+ parts

$13.364

10k+ parts

-

454

$14.849

$14.107

$13.364

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.739

1k+ parts

$1.686

10k+ parts

$1.650

2,000

-

$1.739

$1.686

$1.650

Overview

Upgrade your systems with the high-quality SN65MLVD204BD line driver/receiver by Texas Instruments. Designed with precision and reliability in mind, this compact device offers fast transmission speeds and low power consumption, making it ideal for a wide range of industrial applications. Experience seamless communication and improved efficiency with this advanced solution. Trust Texas Instruments to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it ideal for portable devices.

Surface Mount: YES

Being surface-mountable allows for easy and convenient installation on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient utilization of space on the circuit board, optimizing layout design.

Maximum Transmit Delay: 3.5 ns

The low maximum transmit delay of 3.5 ns ensures fast signal transmission, making the product suitable for high-speed applications.

Maximum Supply Current: 24 mA

With a maximum supply current of 24 mA, the product offers efficient power consumption, contributing to energy-efficient operation.

Technical Specifications

Line Drivers & Receivers SN65MLVD204BD attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

10 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3.5 ns

Width:

3.895 mm

Trade Compliance

SN65MLVD204BD Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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