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SN65MLVD203DG4

Texas Instruments

SN65MLVD203DG4 by Texas Instruments

SN65MLVD203DG4 by Texas Instruments is a Line Driver & Receiver with 14 terminals, operating at 3.3V. It offers a max transmit delay of 2.4ns and differential output characteristics, making it ideal for industrial applications requiring fast signal transmission over short distances.

Median Price

$5.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 113 parts In-Stock

1+ parts

$5.950

100+ parts

$2.680

1k+ parts

$2.230

10k+ parts

-

113

$5.950

$2.680

$2.230

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,422 parts In-Stock

1+ parts

$3.762

100+ parts

-

1k+ parts

-

10k+ parts

-

2,422

$3.762

-

-

-

Vyrian

USA . 4,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,080

-

-

-

-

Prism Electronics

USA . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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125

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,179 parts In-Stock

1+ parts

$3.564

100+ parts

-

1k+ parts

-

10k+ parts

-

2,179

$3.564

-

-

-

Parana Technologies

USA . 1,358 parts In-Stock

1+ parts

$11.977

100+ parts

-

1k+ parts

$12.382

10k+ parts

-

1,358

$11.977

-

$12.382

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DigiPath Technology Company

USA . 1,079 parts In-Stock

1+ parts

$13.188

100+ parts

$12.133

1k+ parts

-

10k+ parts

-

1,079

$13.188

$12.133

-

-

ChromeModa Solutions

Germany . 2,515 parts In-Stock

1+ parts

$13.457

100+ parts

$11.035

1k+ parts

-

10k+ parts

-

2,515

$13.457

$11.035

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-

IDEA Electronic Components Group

UK . 2,311 parts In-Stock

1+ parts

$13.457

100+ parts

$12.784

1k+ parts

$12.111

10k+ parts

-

2,311

$13.457

$12.784

$12.111

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Microchip USA

USA . 2,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,363

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Overview

Elevate your communication systems with the SN65MLVD203DG4 by Texas Instruments, a top-of-the-line Line Driver & Receiver that guarantees unmatched quality and reliability. Designed with cutting-edge technology, this product offers seamless transmission and reception capabilities for industrial-grade applications. With a compact design and superior performance, customers can trust in the value and benefits that come with choosing Texas Instruments. Upgrade your systems today and experience the difference with the SN65MLVD203DG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, particularly in compact electronic devices where space is limited.

Maximum Supply Voltage: 3.6 V

A high maximum supply voltage allows for compatibility with a wide range of power sources, making the product versatile and widely applicable.

Maximum Transmit Delay: 2.4 ns

A low transmit delay ensures fast signal transmission, making the product suitable for applications requiring quick response times.

Power Supplies (V): 3.3

The 3.3V power supply is a common standard in electronic devices, making the product easily integratable into existing systems.

Maximum High Level Input Current: 0.00001 Amp

A low input current requirement helps to minimize power consumption, making the product energy-efficient.

Output Characteristics: DIFFERENTIAL

Differential outputs provide noise immunity and improved signal integrity, making the product reliable in noisy environments.

Maximum Output Low Current: 8 Amp

The high output current capability allows the product to drive demanding loads with ease, enhancing its performance in various applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, the product can withstand harsh operating conditions, ensuring reliable operation in challenging environments.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, the product can effectively transmit and receive signals over long distances, making it suitable for communication applications.

Technical Specifications

Line Drivers & Receivers SN65MLVD203DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-899; TIA-899

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.48 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

6 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

2.4 ns

Width:

3.9 mm

Trade Compliance

SN65MLVD203DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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