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SN65LVDT125ADBT

Texas Instruments

SN65LVDT125ADBT by Texas Instruments

CROSS POINT SWITCH; Temperature Grade: INDUSTRIAL; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$16.657

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 6 parts In-Stock

1+ parts

$14.760

100+ parts

-

1k+ parts

-

10k+ parts

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6

$14.760

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-

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Verical

USA . 6 parts In-Stock

1+ parts

$14.760

100+ parts

-

1k+ parts

-

10k+ parts

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6

$14.760

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-

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Chip1Stop

Japan . 100 parts In-Stock

1+ parts

$15.600

100+ parts

$12.100

1k+ parts

-

10k+ parts

-

100

$15.600

$12.100

-

-

Texas Instruments

USA . 25,412 parts In-Stock

1+ parts

$17.714

100+ parts

$15.473

1k+ parts

$10.671

10k+ parts

-

25,412

$17.714

$15.473

$10.671

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Mouser Electronics

USA . 32 parts In-Stock

1+ parts

$25.230

100+ parts

$17.840

1k+ parts

$17.180

10k+ parts

-

32

$25.230

$17.840

$17.180

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DigiKey

USA . 50 parts In-Stock

1+ parts

$25.430

100+ parts

$17.841

1k+ parts

$16.797

10k+ parts

-

50

$25.430

$17.841

$16.797

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,616 parts In-Stock

1+ parts

$12.293

100+ parts

-

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4,616

$12.293

-

-

-

Component Electronics Inc.

Canada . 20 parts In-Stock

1+ parts

$19.230

100+ parts

$14.420

1k+ parts

$12.500

10k+ parts

-

20

$19.230

$14.420

$12.500

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Vyrian

USA . 7,260 parts In-Stock

1+ parts

-

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7,260

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Cyclops Electronics Ltd

UK . 49 parts In-Stock

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49

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

1+ parts

-

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25

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Holdelec - ElecDif-Pro

France . 25 parts In-Stock

1+ parts

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 559 parts In-Stock

1+ parts

$9.454

100+ parts

-

1k+ parts

$10.065

10k+ parts

-

559

$9.454

-

$10.065

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DigiPath Technology Company

USA . 775 parts In-Stock

1+ parts

$10.410

100+ parts

$9.577

1k+ parts

-

10k+ parts

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775

$10.410

$9.577

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-

ChromeModa Solutions

Germany . 4,067 parts In-Stock

1+ parts

$10.622

100+ parts

$8.710

1k+ parts

-

10k+ parts

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4,067

$10.622

$8.710

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IDEA Electronic Components Group

UK . 2,215 parts In-Stock

1+ parts

$10.622

100+ parts

$10.091

1k+ parts

$9.560

10k+ parts

-

2,215

$10.622

$10.091

$9.560

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Corphita

USA . 1,815 parts In-Stock

1+ parts

$11.646

100+ parts

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10k+ parts

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1,815

$11.646

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Kepictronics

USA . 440 parts In-Stock

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440

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Technical Specifications

Multiplexers & Switches SN65LVDT125ADBT attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.145 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

6 ns

Maximum Switch-on Time:

300 ns

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

SN65LVDT125ADBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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