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SN65LVCP22DR

Texas Instruments

SN65LVCP22DR by Texas Instruments

SN65LVCP22DR by Texas Instruments is a BICMOS technology-based cross point switch with 2 channels. It operates at a nominal voltage of 3.3V and has separate outputs. This industrial-grade device, with a small outline package style, is suitable for applications requiring fast switching times in the temperature range of -40 to 85°C.

Median Price

$4.055

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 78,836 parts In-Stock

1+ parts

$4.444

100+ parts

$3.894

1k+ parts

$2.200

10k+ parts

-

78,836

$4.444

$3.894

$2.200

-

Rochester

USA . 77,407 parts In-Stock

1+ parts

-

100+ parts

$3.160

1k+ parts

$2.830

10k+ parts

$2.660

77,407

-

$3.160

$2.830

$2.660

DigiKey

USA . 77,407 parts In-Stock

1+ parts

-

100+ parts

$4.160

1k+ parts

-

10k+ parts

-

77,407

-

$4.160

-

-

Verical

USA . 77,407 parts In-Stock

1+ parts

-

100+ parts

$3.950

1k+ parts

$3.538

10k+ parts

$3.325

77,407

-

$3.950

$3.538

$3.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,257 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

-

1,257

$2.907

-

-

-

Vyrian

USA . 2,591 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

-

10k+ parts

-

2,591

$3.060

-

-

-

Chip Stock

USA . 15,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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15,100

-

-

-

-

Cyclops Electronics Ltd

UK . 2,794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,794

-

-

-

-

Bristol Electronics

USA . 1,757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,757

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,396 parts In-Stock

1+ parts

$2.754

100+ parts

-

1k+ parts

-

10k+ parts

-

1,396

$2.754

-

-

-

Parana Technologies

USA . 2,049 parts In-Stock

1+ parts

$6.887

100+ parts

-

1k+ parts

$7.500

10k+ parts

-

2,049

$6.887

-

$7.500

-

DigiPath Technology Company

USA . 79 parts In-Stock

1+ parts

$7.583

100+ parts

$6.977

1k+ parts

-

10k+ parts

-

79

$7.583

$6.977

-

-

ChromeModa Solutions

Germany . 6,990 parts In-Stock

1+ parts

$7.738

100+ parts

$6.345

1k+ parts

-

10k+ parts

-

6,990

$7.738

$6.345

-

-

IDEA Electronic Components Group

UK . 1,757 parts In-Stock

1+ parts

$7.738

100+ parts

-

1k+ parts

$6.964

10k+ parts

-

1,757

$7.738

-

$6.964

-

Microchip USA

USA . 4,311 parts In-Stock

1+ parts

$19.590

100+ parts

-

1k+ parts

-

10k+ parts

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4,311

$19.590

-

-

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A-Z Elektronik GmbH

Germany . 5,886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,886

-

-

-

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Kepictronics

USA . 2,704 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,704

-

-

-

-

Overview

Unlock seamless connectivity and unparalleled performance with the SN65LVCP22DR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in every product. This multiplexer offers efficient switching capabilities for various applications, ensuring smooth operations and optimal performance. Say goodbye to connectivity issues and hello to enhanced productivity with the SN65LVCP22DR. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with common power supply voltages, making it versatile for various applications.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable operation even in demanding environments.

Technology: BICMOS

Utilizes Bipolar-CMOS technology for high-speed and low-power operation, enhancing overall performance.

Technical Specifications

Multiplexers & Switches SN65LVCP22DR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Additional Features:

CONFIGURABLE AS 2:1 MUX, 1:2 DEMUX, REPEATER OR 1:2 SIGNAL SPLITTER

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.087 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

4 ns

Maximum Switch-on Time:

4 ns

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

SN65LVCP22DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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