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SN65LVDS32PWRG4

Texas Instruments

SN65LVDS32PWRG4 by Texas Instruments

SN65LVDS32PWRG4 by Texas Instruments is a 16-terminal line driver with 3.6V max supply voltage and 3ns max receive delay. Ideal for EIA-644/TIA-644 interfaces, it operates in industrial temperatures (-40 to 85°C) and features CMOS technology for differential input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,459 parts In-Stock

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Digiode

USA . 1,128 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,097 parts In-Stock

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Bristol Electronics

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Microfarads

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North Shore Components

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Parana Technologies

USA . 1,109 parts In-Stock

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$3.113

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$3.633

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IDEA Electronic Components Group

UK . 2,112 parts In-Stock

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$3.498

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$3.148

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ChromeModa Solutions

Germany . 493 parts In-Stock

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$3.498

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$2.868

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One Stop Electronics

USA . 1,467 parts In-Stock

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$3.500

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AZTECH Wire

Italy . 583 parts In-Stock

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Component Stockers USA

USA . 2,492 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,717 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 4,869 parts In-Stock

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Microchip USA

USA . 4,479 parts In-Stock

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DigiPath Technology Company

USA . 1,552 parts In-Stock

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$3.154

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Overview

Experience unparalleled quality and reliability with the Texas Instruments SN65LVDS32PWRG4. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge Line Drivers & Receivers like no other. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Trust in Texas Instruments to provide you with top-of-the-line technology that exceeds expectations, making your projects seamless and efficient. Choose the SN65LVDS32PWRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the line driver & receiver, ensuring a longer product lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing flexibility in usage and compatibility with a variety of systems.

No. of Functions: 4

Offers multiple functions in a single component, making it a cost-effective solution for applications requiring multiple signal processing tasks.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, ensuring reliable performance even in challenging conditions.

Technical Specifications

Line Drivers & Receivers SN65LVDS32PWRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN65LVDS32PWRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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