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SN65LVDS32DRG4

Texas Instruments

SN65LVDS32DRG4 by Texas Instruments

SN65LVDS32DRG4 by Texas Instruments is a CMOS line receiver with 4 functions, operating at 3.3V. It features EIA-644/TIA-644 interface standard, differential input characteristics, and a max supply current of 18mA. Ideal for industrial applications requiring high-speed data transmission over short distances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,510 parts In-Stock

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Digiode

USA . 4,876 parts In-Stock

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4,876

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Chip Stock

USA . 3,380 parts In-Stock

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3,380

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Nova Conductors

Japan . 71 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 200 parts In-Stock

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$9.903

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200

$9.903

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Parana Technologies

USA . 2,200 parts In-Stock

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$10.290

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$10.819

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$10.290

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$10.819

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ChromeModa Solutions

Germany . 4,624 parts In-Stock

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$11.562

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$9.481

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$11.562

$9.481

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IDEA Electronic Components Group

UK . 823 parts In-Stock

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$11.562

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$10.984

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$10.406

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823

$11.562

$10.984

$10.406

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One Stop Electronics

USA . 841 parts In-Stock

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$19.500

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841

$19.500

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Ampacity Inc.

Singapore . 942 parts In-Stock

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$39.500

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$39.500

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Microchip USA

USA . 2,833 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Corphita

USA . 2,382 parts In-Stock

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DigiPath Technology Company

USA . 746 parts In-Stock

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$10.424

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$10.424

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Bastille Electronics

Australia . 56 parts In-Stock

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Overview

Unleash the power of communication with the SN65LVDS32DRG4 from Texas Instruments. This cutting-edge Line Driver & Receiver offers unparalleled quality and reliability, embodying the excellence that TI is known for. Ideal for industrial applications, this product provides seamless connectivity and high-speed data transmission. Elevate your projects with the value and benefits this versatile component brings, delivering top-notch performance and efficiency. Trust Texas Instruments to bring innovation to your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation and integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making the product versatile and compatible with various systems.

No. of Functions: 4

Offers multiple functions in a single device, reducing the need for additional components and simplifying the design.

Package Shape: RECTANGULAR

Facilitates easy placement and routing on circuit boards, optimizing space utilization in electronic devices.

Power Supplies (V): 3.3

Operates efficiently at a standard voltage level, ensuring compatibility with common power sources.

Minimum Operating Temperature: -40 °C

Functions reliably in low-temperature environments, making it suitable for a wide range of operating conditions.

Maximum Output Low Current: 8 Amp

Delivers high output current, enabling robust signal transmission and reception capabilities.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance and reliability.

Interface Standard: EIA-644; TIA-644

Complies with industry standards for communication interfaces, ensuring interoperability with other devices.

Technical Specifications

Line Drivers & Receivers SN65LVDS32DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

3 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65LVDS32DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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