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SN65LVDS311YFFT

Texas Instruments

SN65LVDS311YFFT by Texas Instruments

SN65LVDS311YFFT by Texas Instruments is a CMOS technology line driver with 3 bits. It operates at 1.8V, has a max supply current of 36.8mA, and offers differential outputs. Ideal for industrial applications requiring high-speed data transmission over short distances.

Median Price

$5.086

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$4.081

100+ parts

$3.327

1k+ parts

$2.218

10k+ parts

-

1,500

$4.081

$3.327

$2.218

-

DigiKey

USA . 153 parts In-Stock

1+ parts

$6.090

100+ parts

$3.930

1k+ parts

$3.576

10k+ parts

$3.442

153

$6.090

$3.930

$3.576

$3.442

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,502 parts In-Stock

1+ parts

$3.877

100+ parts

-

1k+ parts

-

10k+ parts

-

1,502

$3.877

-

-

-

Vyrian

USA . 4,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,393

-

-

-

-

Sea View Technologies

USA . 2,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,411

-

-

-

-

Bristol Electronics

USA . 2,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,411

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,515 parts In-Stock

1+ parts

$3.673

100+ parts

-

1k+ parts

-

10k+ parts

-

4,515

$3.673

-

-

-

Component Stockers USA

USA . 218 parts In-Stock

1+ parts

$5.740

100+ parts

$4.220

1k+ parts

-

10k+ parts

-

218

$5.740

$4.220

-

-

Parana Technologies

USA . 1,427 parts In-Stock

1+ parts

$12.902

100+ parts

$1,198.177

1k+ parts

$11.612

10k+ parts

-

1,427

$12.902

$1,198.177

$11.612

-

DigiPath Technology Company

USA . 301 parts In-Stock

1+ parts

$14.207

100+ parts

-

1k+ parts

-

10k+ parts

-

301

$14.207

-

-

-

ChromeModa Solutions

Germany . 4,551 parts In-Stock

1+ parts

$14.497

100+ parts

$11.888

1k+ parts

-

10k+ parts

-

4,551

$14.497

$11.888

-

-

IDEA Electronic Components Group

UK . 1,222 parts In-Stock

1+ parts

$14.497

100+ parts

$13.772

1k+ parts

$13.047

10k+ parts

-

1,222

$14.497

$13.772

$13.047

-

Microchip USA

USA . 2,817 parts In-Stock

1+ parts

$26.940

100+ parts

$26.770

1k+ parts

$26.690

10k+ parts

$26.610

2,817

$26.940

$26.770

$26.690

$26.610

QUARKTWIN TECHNOLOGY LTD

USA . 14,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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14,461

-

-

-

-

Overview

Experience unparalleled performance and reliability with the SN65LVDS311YFFT line driver by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in their products. The SN65LVDS311YFFT is perfect for a wide range of applications, offering customers exceptional value and benefits. Its differential output, complementary polarity, and industrial-grade temperature grade make it a versatile choice for various projects. Trust Texas Instruments to deliver superior solutions for your line driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.95 V

Operating at a maximum supply voltage of 1.95V ensures efficient power consumption.

Package Shape: SQUARE

Square package shape provides a compact design for efficient placement on circuit boards.

No. of Terminals: 49

Having 49 terminals allows for versatile connectivity options in different circuit configurations.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments.

Output Characteristics: DIFFERENTIAL

Differential output ensures high signal integrity and noise immunity in data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Pitch: 0.4 mm

Having a terminal pitch of 0.4mm allows for precise and compact connections on the PCB.

Technical Specifications

Line Drivers & Receivers SN65LVDS311YFFT attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

3

Maximum High Level Input Current:

.0000002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Length:

3.09 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

DIFFERENTIAL

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

.625 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

36.8 mA

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

1.95 V

Minimum Supply Voltage-1:

1.65 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.09 mm

Trade Compliance

SN65LVDS311YFFT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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