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SN65LVDS108DBT

Texas Instruments

SN65LVDS108DBT by Texas Instruments

SN65LVDS108DBT by Texas Instruments is a CMOS line driver with 8 bits, operating at 3.3V. It features EIA-644 and TIA-644 interface standards, differential output, and a max transmit delay of 4.5ns. Ideal for industrial applications requiring high-speed data transmission in compact spaces due to its small outline package style.

Median Price

$5.500

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 11 parts In-Stock

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$0.861

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$0.861

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Texas Instruments

USA . 22,460 parts In-Stock

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$6.477

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$5.280

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$3.520

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22,460

$6.477

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$3.520

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Mouser Electronics

USA . 114 parts In-Stock

1+ parts

$8.150

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$5.350

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$4.780

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114

$8.150

$5.350

$4.780

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Chip1Stop

Japan . 250 parts In-Stock

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$4.207

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$4.207

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Rochester

USA . 186 parts In-Stock

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$4.400

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$3.940

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$3.700

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$3.700

DigiKey

USA . 186 parts In-Stock

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$5.790

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$5.790

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Verical

USA . 94 parts In-Stock

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$5.500

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$4.925

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$4.625

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$5.500

$4.925

$4.625

Distributors (In-Stock)

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Digiode

USA . 4,214 parts In-Stock

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$0.818

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$0.818

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Nova Conductors

Japan . 54 parts In-Stock

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$4.557

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$4.557

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TEDSS.com

USA . 100 parts In-Stock

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$4.990

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Chip Stock

USA . 14,836 parts In-Stock

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Vyrian

USA . 2,116 parts In-Stock

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Connector Distribution Corp

USA . 1,652 parts In-Stock

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Right Parts Inc.

USA . 1,652 parts In-Stock

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R&J Components

USA . 100 parts In-Stock

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Prism Electronics

USA . 60 parts In-Stock

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Bristol Electronics

USA . 40 parts In-Stock

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Electronics Depot

USA . 34 parts In-Stock

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Lantek

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Sea View Technologies

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Semtec, LLC

USA . 7 parts In-Stock

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Semi Source

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,171 parts In-Stock

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$0.730

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$0.730

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Corphita

USA . 3,979 parts In-Stock

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$0.775

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$0.775

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Aranea Global

USA . 100 parts In-Stock

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$4.466

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$4.287

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$4.466

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Continental Prestige Electronics

USA . 4 parts In-Stock

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$5.790

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Parana Technologies

USA . 1,904 parts In-Stock

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$9.173

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$851.874

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$8.256

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DigiPath Technology Company

USA . 1,390 parts In-Stock

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$10.101

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$9.293

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$10.101

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ChromeModa Solutions

Germany . 3,258 parts In-Stock

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$10.307

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$8.452

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$10.307

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IDEA Electronic Components Group

UK . 837 parts In-Stock

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$10.307

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$9.792

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$9.276

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Argo Parts USA

USA . 3,701 parts In-Stock

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A-Z Elektronik GmbH

Germany . 825 parts In-Stock

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Perfect Parts

USA . 711 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Experience unparalleled performance and reliability with the SN65LVDS108DBT by Texas Instruments, a leading manufacturer known for its cutting-edge technology. This Line Driver & Receiver offers seamless communication in a wide range of applications, delivering superior quality and efficiency. With its advanced features and innovative design, this product ensures optimal functionality and precision. Trust Texas Instruments to provide top-notch solutions that meet your needs and exceed your expectations. Elevate your projects with the SN65LVDS108DBT and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology makes installation easier and more efficient, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power input options and compatibility with a wider range of systems.

Package Shape: RECTANGULAR

The rectangular package shape makes it easier to integrate the product into various electronic devices and circuit layouts.

Maximum Transmit Delay: 4.5 ns

A low transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed communication applications.

Power Supplies (V): 3.3

The 3.3V power supply is a common standard in many electronic devices, ensuring compatibility and ease of integration.

No. of Terminals: 38

Having a higher number of terminals allows for more connectivity options and versatility in connecting to other components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can function reliably in various environmental conditions without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in data transmission.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and better solder joint integrity, ensuring a secure connection in the circuit.

Technical Specifications

Line Drivers & Receivers SN65LVDS108DBT attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

8

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4.5 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

85 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

4.5 ns

Width:

4.4 mm

Trade Compliance

SN65LVDS108DBT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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