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SN65LBC176AQDREP

Texas Instruments

SN65LBC176AQDREP by Texas Instruments

SN65LBC176AQDREP by Texas Instruments is a Line Driver & Receiver with 5V supply, 12ns max transmit delay, and 30ns max receive delay. Ideal for automotive applications due to its EIA-485-A interface standard and BICMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,997 parts In-Stock

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3,997

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Digiode

USA . 750 parts In-Stock

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750

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Nova Conductors

Japan . 24 parts In-Stock

1+ parts

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24

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Distributors (Availability)

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AZTECH Wire

Italy . 836 parts In-Stock

1+ parts

$5.333

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836

$5.333

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Parana Technologies

USA . 1,475 parts In-Stock

1+ parts

$9.908

100+ parts

-

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$10.478

10k+ parts

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1,475

$9.908

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$10.478

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ChromeModa Solutions

Germany . 1,790 parts In-Stock

1+ parts

$11.133

100+ parts

$9.129

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1,790

$11.133

$9.129

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IDEA Electronic Components Group

UK . 1,052 parts In-Stock

1+ parts

$11.133

100+ parts

$10.576

1k+ parts

$10.020

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1,052

$11.133

$10.576

$10.020

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Microchip USA

USA . 3,439 parts In-Stock

1+ parts

$29.330

100+ parts

$29.150

1k+ parts

$29.060

10k+ parts

$28.970

3,439

$29.330

$29.150

$29.060

$28.970

One Stop Electronics

USA . 767 parts In-Stock

1+ parts

$34.500

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767

$34.500

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Ampacity Inc.

Singapore . 835 parts In-Stock

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$44.500

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835

$44.500

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Continental Prestige Electronics

USA . 4,455 parts In-Stock

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4,455

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Argo Parts USA

USA . 4,053 parts In-Stock

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Corphita

USA . 3,063 parts In-Stock

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3,063

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QUARKTWIN TECHNOLOGY LTD

USA . 2,609 parts In-Stock

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2,609

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DigiPath Technology Company

USA . 372 parts In-Stock

1+ parts

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100+ parts

$10.038

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372

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$10.038

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Upgrade your communication systems with the SN65LBC176AQDREP by Texas Instruments. This top-quality Line Driver & Receiver is designed to enhance data transmission reliability and efficiency in various applications. With a focus on innovation and performance, Texas Instruments delivers cutting-edge technology that meets the highest industry standards. Experience seamless connectivity, improved signal integrity, and robust design with this versatile product. Trust Texas Instruments to provide you with the solutions you need for superior performance and value. Elevate your system capabilities with the SN65LBC176AQDREP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Supports a wide range of power supply voltages, making it versatile for different applications.

Maximum Transmit Delay: 12 ns

Ensures fast data transmission, ideal for high-speed communication systems.

Output Characteristics: 3-STATE

Allows the output to be in one of three states - high, low, or high impedance, providing flexibility in data transmission.

Technology: BICMOS

Combines the advantages of bipolar and CMOS technologies, offering high-speed performance with low power consumption.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Complies with industry standards for data communication, ensuring compatibility with a wide range of devices.

Technical Specifications

Line Drivers & Receivers SN65LBC176AQDREP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.9 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

30 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

3.9 mm

Trade Compliance

SN65LBC176AQDREP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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