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SN65LBC170DBR

Texas Instruments

SN65LBC170DBR by Texas Instruments

SN65LBC170DBR by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 5V. It features a max transmit delay of 12ns and differential output. Ideal for industrial applications requiring EIA-422, TIA-422, EIA-485, TIA-485 interface standards in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,647 parts In-Stock

1+ parts

-

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4,647

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Vyrian

USA . 3,145 parts In-Stock

1+ parts

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3,145

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Chip Stock

USA . 145 parts In-Stock

1+ parts

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145

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Nova Conductors

Japan . 92 parts In-Stock

1+ parts

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92

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 226 parts In-Stock

1+ parts

$7.723

100+ parts

$717.237

1k+ parts

$6.951

10k+ parts

-

226

$7.723

$717.237

$6.951

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DigiPath Technology Company

USA . 1,797 parts In-Stock

1+ parts

$8.504

100+ parts

-

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1,797

$8.504

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ChromeModa Solutions

Germany . 5,674 parts In-Stock

1+ parts

$8.678

100+ parts

$7.116

1k+ parts

-

10k+ parts

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5,674

$8.678

$7.116

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IDEA Electronic Components Group

UK . 1,276 parts In-Stock

1+ parts

$8.678

100+ parts

$8.244

1k+ parts

$7.810

10k+ parts

-

1,276

$8.678

$8.244

$7.810

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One Stop Electronics

USA . 1,012 parts In-Stock

1+ parts

$13.500

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1,012

$13.500

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AZTECH Wire

Italy . 760 parts In-Stock

1+ parts

$19.010

100+ parts

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760

$19.010

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Ampacity Inc.

Singapore . 1,182 parts In-Stock

1+ parts

$38.500

100+ parts

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1,182

$38.500

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Corphita

USA . 1,916 parts In-Stock

1+ parts

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1,916

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Bastille Electronics

Australia . 650 parts In-Stock

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650

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Kepictronics

USA . 473 parts In-Stock

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473

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Microchip USA

USA . 321 parts In-Stock

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321

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A-Z Elektronik GmbH

Germany . 165 parts In-Stock

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165

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Overview

Experience the high-quality performance and reliability of Texas Instruments with the SN65LBC170DBR Line Drivers & Receivers. Ideal for industrial applications, this product offers seamless communication with its differential output, ensuring accurate data transmission. With a wide operating temperature range and compact design, this line driver and receiver is perfect for demanding environments. Trust in Texas Instruments to deliver innovative solutions that meet your needs and exceed expectations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability while maintaining a lightweight design.

Surface Mount:

YES - Allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage:

5.25 V - Ensures compatibility with a wide range of systems and applications.

No. of Functions:

3 - Offers versatility and flexibility in signal processing and transmission.

Package Shape:

RECTANGULAR - Facilitates efficient utilization of space on a PCB.

Maximum Transmit Delay:

12 ns - Ensures fast and reliable data transmission with minimal delay.

Power Supplies (V):

5 - Standard voltage requirement for seamless integration into existing systems.

No. of Terminals:

16 - Provides multiple connection points for enhanced connectivity options.

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH - Ideal for compact designs and high-density PCB layouts.

Minimum Supply Voltage:

4.75 V - Allows for operation even under low voltage conditions without sacrificing performance.

Maximum Operating Temperature:

85 °C - Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature:

40 °C - Ideal for use in extreme temperature conditions without compromising functionality.

Terminal Finish:

NICKEL PALLADIUM GOLD - Offers superior corrosion resistance and signal quality.

Terminal Position:

DUAL - Provides redundancy and flexibility in connection options.

Maximum Seated Height:

2 mm - Low profile design for space-constrained applications.

Width:

5.3 mm - Compact size for efficient PCB layout and space-saving designs.

Maximum Output Low Current:

8 Amp - Provides high current capability for driving loads without overheating.

Receiver No. of Bits:

3 - Suitable for processing data with precision and accuracy.

Differential Output:

YES - Offers noise immunity and signal integrity over long distances.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures efficient soldering during assembly for reliable connections.

Peak Reflow Temperature °C:

260 - Withstands high-temperature reflow processes for durable solder joints.

Length:

6.2 mm - Compact size for space-constrained applications.

Minimum Out Swing:

1 V - Allows for precise signal level control for accurate data transmission.

Temperature Grade:

INDUSTRIAL - Suitable for harsh industrial environments with varying temperature ranges.

Maximum Receive Delay:

16 ns - Ensures quick response and processing of incoming data signals.

Technology:

BICMOS - Combines the advantages of bipolar and CMOS technologies for high-speed operation and low power consumption.

Terminal Form:

GULL WING - Facilitates easy and secure soldering onto PCBs.

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482; X3.277 - Offers compatibility with various industry-standard communication protocols.

Maximum Supply Current:

20 mA - Provides low power consumption for energy-efficient operation.

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER - Ensures accurate signal detection and processing.

Nominal Supply Voltage:

5 V - Standard voltage for seamless integration into existing systems.

Terminal Pitch:

0.65 mm - Allows for precise and compact terminal spacing on the PCB.

Driver No. of Bits:

3 - Suitable for transmitting data with high precision and accuracy.

Interface IC Type:

LINE TRANSCEIVER - Ideal for interfacing and communicating with other devices in a network.

Technical Specifications

Line Drivers & Receivers SN65LBC170DBR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

3

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; TIA-422; EIA-485; TIA-485; ISO 8482; X3.277

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

16 ns

Receiver No. of Bits:

3

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

12 ns

Width:

5.3 mm

Trade Compliance

SN65LBC170DBR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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