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SN65HVDA541QDR

Texas Instruments

SN65HVDA541QDR by Texas Instruments

SN65HVDA541QDR by Texas Instruments is an 8-terminal bus driver/transceiver with a supply voltage range of 4.75V to 5.25V and a propagation delay of 130ns. It operates in automotive-grade temperatures (-40°C to 125°C) and features a small outline package suitable for surface mount applications. This TTL technology device has dual terminal positions, true output polarity, and supports two ports with 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,992 parts In-Stock

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6,992

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Digiode

USA . 552 parts In-Stock

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552

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Distributors (Availability)

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Andel Nordic

Denmark . 2,319 parts In-Stock

1+ parts

$8.775

100+ parts

-

1k+ parts

$8.424

10k+ parts

$8.424

2,319

$8.775

-

$8.424

$8.424

AZTECH Wire

Italy . 666 parts In-Stock

1+ parts

$9.366

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666

$9.366

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Parana Technologies

USA . 2,135 parts In-Stock

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$22.289

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$22.964

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2,135

$22.289

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$22.964

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ChromeModa Solutions

Germany . 2,027 parts In-Stock

1+ parts

$25.044

100+ parts

$20.536

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2,027

$25.044

$20.536

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IDEA Electronic Components Group

UK . 702 parts In-Stock

1+ parts

$25.044

100+ parts

$23.792

1k+ parts

$22.540

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702

$25.044

$23.792

$22.540

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One Stop Electronics

USA . 1,245 parts In-Stock

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$61.000

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$61.000

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Corphita

USA . 4,688 parts In-Stock

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DigiPath Technology Company

USA . 1,680 parts In-Stock

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$22.580

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1,680

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$22.580

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A-Z Elektronik GmbH

Germany . 600 parts In-Stock

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600

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Overview

Looking for a reliable solution for your bus driver & transceiver needs? Look no further than the SN65HVDA541QDR by Texas Instruments. Boasting superior quality and precision engineering, this small outline package offers a nominal supply voltage of 5V and a temperature grade suitable for automotive applications. With a propagation delay of only 130ns and true output polarity, this device ensures quick and efficient communication within your system. Trust Texas Instruments to provide you with the best technology for all your bus driver and transceiver requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for use in automotive applications.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it convenient for most applications.

Propagation Delay (tpd): 130 ns

The low propagation delay of 130ns ensures fast signal transmission, making the product suitable for high-speed data communication.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the product can withstand harsh conditions, making it suitable for automotive environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows the device to have three output states, providing flexibility in controlling connected devices.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40°C ensures reliable performance in a wide range of operating conditions.

Technology: TTL

The TTL technology used in the product provides fast signal processing and compatibility with other TTL devices, making it a versatile choice for various applications.

Technical Specifications

Bus Driver & Transceivers SN65HVDA541QDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

54

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

130 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN65HVDA541QDR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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