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SN65HVD21MDREPG4

Texas Instruments

SN65HVD21MDREPG4 by Texas Instruments

SN65HVD21MDREPG4 by Texas Instruments is a Line Driver & Receiver with 5.5V max supply voltage, 60ns max transmit delay, and 125°C max operating temperature. Ideal for EIA-485-A/TIA-485-A interface standard applications requiring BICMOS technology and differential output with true polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Vyrian

USA . 5,772 parts In-Stock

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5,772

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Digiode

USA . 292 parts In-Stock

1+ parts

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292

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Nova Conductors

Japan . 55 parts In-Stock

1+ parts

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55

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 560 parts In-Stock

1+ parts

$3.143

100+ parts

-

1k+ parts

$3.662

10k+ parts

-

560

$3.143

-

$3.662

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ChromeModa Solutions

Germany . 3,427 parts In-Stock

1+ parts

$3.531

100+ parts

$2.895

1k+ parts

-

10k+ parts

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3,427

$3.531

$2.895

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IDEA Electronic Components Group

UK . 494 parts In-Stock

1+ parts

$3.531

100+ parts

-

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$3.178

10k+ parts

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494

$3.531

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$3.178

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AZTECH Wire

Italy . 535 parts In-Stock

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$7.631

100+ parts

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535

$7.631

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One Stop Electronics

USA . 381 parts In-Stock

1+ parts

$13.500

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381

$13.500

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Ampacity Inc.

Singapore . 546 parts In-Stock

1+ parts

$33.500

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546

$33.500

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Argo Parts USA

USA . 4,470 parts In-Stock

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4,470

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Kepictronics

USA . 3,200 parts In-Stock

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Continental Prestige Electronics

USA . 2,624 parts In-Stock

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Microchip USA

USA . 2,001 parts In-Stock

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Corphita

USA . 1,950 parts In-Stock

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DigiPath Technology Company

USA . 1,374 parts In-Stock

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$3.184

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1,374

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$3.184

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Experience superior communication reliability with the SN65HVD21MDREPG4 by Texas Instruments, a top-tier manufacturer in the industry. This line driver and receiver offers unmatched performance and versatility in various applications. With its advanced technology and high-quality construction, this product ensures seamless data transmission and reception. Trust in Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the SN65HVD21MDREPG4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability in a variety of operating conditions.

Maximum Supply Voltage: 5.5 V

The 5.5V maximum supply voltage allows for flexibility in power source selection and compatibility with a wide range of systems.

Maximum Transmit Delay: 60 ns

The low transmit delay of 60 ns ensures fast and efficient data transmission, making this product suitable for time-sensitive applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high flexibility in controlling the output signal, enabling efficient communication protocols.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the product can operate reliably in harsh environmental conditions, making it ideal for rugged applications.

Interface Standard: EIA-485-A; TIA-485-A

Compliance with EIA-485-A and TIA-485-A interface standards ensures compatibility and interoperability with a wide range of communication systems.

Technical Specifications

Line Drivers & Receivers SN65HVD21MDREPG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1.8 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

60 ns

Width:

3.9 mm

Trade Compliance

SN65HVD21MDREPG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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