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SN65HVD11QP

Texas Instruments

SN65HVD11QP by Texas Instruments

SN65HVD11QP by Texas Instruments is a Line Driver & Receiver with 3.6V max supply voltage, 40ns max transmit delay, and 3.3V power supplies. Ideal for automotive applications, it features EIA-485-A interface standard and operates in temperatures ranging from -40 to 125°C.

Median Price

$2.300

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,010 parts In-Stock

1+ parts

$2.300

100+ parts

$2.250

1k+ parts

$2.210

10k+ parts

-

2,010

$2.300

$2.250

$2.210

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,485

-

-

-

-

Digiode

USA . 4,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,584

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 777 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

777

$4.500

-

-

-

Parana Technologies

USA . 1,304 parts In-Stock

1+ parts

$12.924

100+ parts

-

1k+ parts

$13.410

10k+ parts

-

1,304

$12.924

-

$13.410

-

One Stop Electronics

USA . 833 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

-

10k+ parts

-

833

$14.500

-

-

-

ChromeModa Solutions

Germany . 4,775 parts In-Stock

1+ parts

$14.521

100+ parts

$11.907

1k+ parts

-

10k+ parts

-

4,775

$14.521

$11.907

-

-

IDEA Electronic Components Group

UK . 1,985 parts In-Stock

1+ parts

$14.521

100+ parts

$13.795

1k+ parts

$13.069

10k+ parts

-

1,985

$14.521

$13.795

$13.069

-

AZTECH Wire

Italy . 735 parts In-Stock

1+ parts

$18.155

100+ parts

-

1k+ parts

-

10k+ parts

-

735

$18.155

-

-

-

Corphita

USA . 3,770 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,770

-

-

-

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DigiPath Technology Company

USA . 1,179 parts In-Stock

1+ parts

-

100+ parts

$13.092

1k+ parts

-

10k+ parts

-

1,179

-

$13.092

-

-

Microchip USA

USA . 251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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251

-

-

-

-

Overview

Get ready to experience top-notch performance with the SN65HVD11QP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. The SN65HVD11QP falls under the Line Drivers & Receivers category, making it ideal for various applications. With a maximum transmit delay of 40ns and differential output, this product ensures fast and efficient data transmission. Trust in Texas Instruments to provide you with cutting-edge technology that exceeds your expectations. Elevate your projects with the SN65HVD11QP today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltages, providing flexibility in different voltage requirements.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and compact designs.

Maximum Transmit Delay: 40 ns

Fast transmit delay ensures quick data transmission, essential for real-time applications.

Power Supplies (V): 3.3

Optimal power supply voltage for efficient performance and compatibility with different systems.

No. of Terminals: 8

Sufficient number of terminals for connecting to various devices and components.

Package Style (Meter): IN-LINE

In-line package style offers easy installation and space-saving design.

Maximum High Level Input Current: 0.0001 Amp

Low input current minimizes power consumption and reduces heat dissipation.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, saving energy and suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Can function in extreme cold temperatures, ideal for outdoor or industrial settings.

Terminal Position: DUAL

Dual terminal position offers flexibility in wiring and connectivity options.

Maximum Seated Height: 5.08 mm

Low seated height enables compact and slim designs for space-constrained applications.

Width: 7.62 mm

Narrow width facilitates integration into tight spaces and crowded circuit boards.

Maximum Output Low Current: 8 Amp

High output current capability ensures reliable signal transmission and strong driving capability.

Differential Output: YES

Differential output helps reduce noise interference and improves signal quality over long distances.

Length: 9.81 mm

Compact length allows for efficient use of PCB space and easier routing of connections.

Minimum Out Swing: 1.5 V

Low swing voltage minimizes power consumption and enhances signal integrity.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability in automotive applications with varying temperature conditions.

Maximum Receive Delay: 70 ns

Quick receive delay ensures responsive data reception and communication.

Technology: BICMOS

BiCMOS technology offers a blend of bipolar and CMOS characteristics, providing high performance and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for secure and reliable solder connections on PCBs.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Compliance with industry interface standards ensures compatibility and interoperability with different systems.

Maximum Supply Current: 15.5 mA

Low supply current consumption for efficient power usage and reduced operating costs.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input ensures noise immunity and signal stability, especially in noisy environments.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance and reliable operation.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy PCB design and compatibility with off-the-shelf components.

Interface IC Type: LINE TRANSCEIVER

Line transceiver IC type enables bidirectional communication and signal conversion, suitable for interfacing with multiple devices.

Technical Specifications

Line Drivers & Receivers SN65HVD11QP attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE 10 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDIP-T8

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

40 ns

Width:

7.62 mm

Trade Compliance

SN65HVD11QP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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