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SN54LS612FK

Texas Instruments

SN54LS612FK by Texas Instruments

SN54LS612FK by Texas Instruments is a TTL technology chip carrier with 44 terminals and 12 I/O lines. It operates b/w -55 to 125 °C, with supply voltage range of 4.5V to 5.5V. Ideal for military-grade parallel I/O port applications requiring general-purpose functionality in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,045 parts In-Stock

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5,045

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Digiode

USA . 4,967 parts In-Stock

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4,967

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,297 parts In-Stock

1+ parts

$14.768

100+ parts

-

1k+ parts

$15.205

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2,297

$14.768

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$15.205

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AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$16.245

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613

$16.245

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DigiPath Technology Company

USA . 491 parts In-Stock

1+ parts

$16.261

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$14.960

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491

$16.261

$14.960

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IDEA Electronic Components Group

UK . 440 parts In-Stock

1+ parts

$16.593

100+ parts

$15.763

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$14.934

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440

$16.593

$15.763

$14.934

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ChromeModa Solutions

Germany . 263 parts In-Stock

1+ parts

$16.593

100+ parts

$13.606

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263

$16.593

$13.606

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One Stop Electronics

USA . 331 parts In-Stock

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$32.000

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331

$32.000

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Corohmni

South Africa . 2,679 parts In-Stock

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$49.320

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2,679

$49.320

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Corphita

USA . 3,690 parts In-Stock

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3,690

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Overview

Elevate your electronics projects with the SN54LS612FK by Texas Instruments, a high-quality parallel I/O port chip carrier that offers unparalleled performance and reliability. Manufactured with CERAMIC, METAL-SEALED COFIRED materials, this device is designed to operate in extreme temperatures, making it ideal for military-grade applications. With 12 I/O lines and a maximum supply voltage of 5.5V, this versatile component provides flexibility and precision. Upgrade your designs with Texas Instruments' trusted technology and unlock endless possibilities for your next innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Allows for easy and secure placement on a circuit board, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Supports a relatively high supply voltage, making it compatible with a wide range of applications.

Package Shape: SQUARE

The square shape provides a compact design, optimizing space utilization on the PCB.

No. of Terminals: 44

Having 44 terminals enables connectivity with various external devices and peripherals.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers reliable performance and ease of integration in electronic systems.

Minimum Supply Voltage: 4.5 V

Works efficiently even at low supply voltages, ensuring flexibility in power requirements.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for industrial and harsh environments.

Minimum Operating Temperature: -55 °C

Can withstand sub-zero temperatures, making it suitable for a wide range of operating environments.

Terminal Position: QUAD

The quad terminal position allows for easy connection and routing of signals within the circuit.

Maximum Seated Height: 2.03 mm

With a low seated height, this product can be used in compact electronic designs.

Width: 16.51 mm

The moderate width provides a good balance between space-saving and ease of handling during assembly.

Length: 16.51 mm

The length of 16.51 mm offers a compact footprint without compromising on functionality.

Temperature Grade: MILITARY

Designed to meet stringent military-grade standards for reliability and performance in demanding applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this product is versatile and can be used in a variety of applications.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of devices and systems.

Terminal Form: NO LEAD

The no lead terminal form offers improved reliability and soldering performance.

Nominal Supply Voltage: 5 V

Operates at the standard 5V supply voltage, making it compatible with many electronic systems.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product allows for high-density packaging on the PCB.

No. of I/O Lines: 12

With 12 I/O lines, this product offers sufficient connectivity for diverse input and output requirements.

Technical Specifications

Parallel I/O Ports SN54LS612FK attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

S-CQCC-N44

Length:

16.51 mm

No. of I/O Lines:

12

No. of Ports:

1

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.51 mm

Peripheral IC Type:

Trade Compliance

SN54LS612FK Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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