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SN54LS610JD

Texas Instruments

SN54LS610JD by Texas Instruments

SN54LS610JD by Texas Instruments is a CMOS technology-based parallel I/O port with 12 I/O lines. It operates b/w -55°C to 125°C, suitable for military-grade applications. With a supply voltage range of 4.5V to 5.5V, it features a ceramic-metal sealed co-fired package body ideal for robust in-line installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,769 parts In-Stock

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Digiode

USA . 497 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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One Stop Electronics

USA . 674 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 694 parts In-Stock

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$11.773

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Parana Technologies

USA . 1,946 parts In-Stock

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$22.309

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$22.983

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DigiPath Technology Company

USA . 911 parts In-Stock

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$24.565

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ChromeModa Solutions

Germany . 2,501 parts In-Stock

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$25.066

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$20.554

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IDEA Electronic Components Group

UK . 2,097 parts In-Stock

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$25.066

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$23.813

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$22.559

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Corohmni

South Africa . 3,016 parts In-Stock

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Corphita

USA . 2,186 parts In-Stock

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Overview

Unleash the power of connectivity with the SN54LS610JD Parallel I/O Ports by Texas Instruments. Crafted with precision and reliability, this innovative product offers seamless integration for a wide range of applications. Elevate your projects with the superior quality and cutting-edge technology that only Texas Instruments can deliver. Experience the convenience and efficiency of this advanced peripheral IC type, designed to enhance your experience with 12 I/O lines and a versatile package style. Upgrade your electronics with the SN54LS610JD and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments or applications where high temperature or pressure may be present.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of devices or systems.

Package Shape: RECTANGULAR

The rectangular shape enables efficient utilization of space and easy integration into circuit layouts or designs.

No. of Terminals: 40

Having a high number of terminals provides versatility in connectivity options, allowing for multiple input/output configurations.

Package Style (Meter): IN-LINE

The in-line package style simplifies installation and maintenance processes, enhancing usability and convenience.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with various power sources, making the product versatile and widely applicable.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extreme conditions or temperature fluctuations, ensuring reliable performance in challenging environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the product to function effectively in cold climates or refrigerated settings without compromising performance.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in wiring configurations, enabling customized connectivity solutions for specific needs or requirements.

Temperature Grade: MILITARY

The military-grade temperature tolerance ensures the product's reliability and performance even in harsh military or defense applications where durability is essential.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port, the product is versatile and can be used in a wide range of applications, making it a cost-effective and practical choice.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various devices, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of soldering, ensuring stable and durable connections for reliable performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a commonly used standard in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy connection to breadboards, PCBs, or other electronic components, facilitating quick and convenient installations.

No. of I/O Lines: 12

Having 12 I/O lines provides sufficient input/output capabilities for versatile connectivity options and integration with other devices or systems, making the product suitable for a variety of applications.

Technical Specifications

Parallel I/O Ports SN54LS610JD attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-CDIP-T40

No. of I/O Lines:

12

No. of Ports:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SN54LS610JD Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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