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SN54LS292FK

Texas Instruments

SN54LS292FK by Texas Instruments

SN54LS292FK by Texas Instruments is a TTL technology prescaler with 2 data/clock inputs, 120 ns propagation delay, and 30 MHz min fmax. It operates in military-grade temperatures from -55 to 125 °C and has a package style of chip carrier. Ideal for applications requiring precise frequency division and synchronization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,705 parts In-Stock

1+ parts

-

100+ parts

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3,705

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Digiode

USA . 870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 402 parts In-Stock

1+ parts

$5.233

100+ parts

-

1k+ parts

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-

402

$5.233

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-

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Parana Technologies

USA . 1,558 parts In-Stock

1+ parts

$27.813

100+ parts

-

1k+ parts

$40.309

10k+ parts

-

1,558

$27.813

-

$40.309

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DigiPath Technology Company

USA . 2,205 parts In-Stock

1+ parts

$30.626

100+ parts

-

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2,205

$30.626

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ChromeModa Solutions

Germany . 4,671 parts In-Stock

1+ parts

$31.251

100+ parts

$25.626

1k+ parts

-

10k+ parts

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4,671

$31.251

$25.626

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IDEA Electronic Components Group

UK . 1,727 parts In-Stock

1+ parts

$31.251

100+ parts

$29.688

1k+ parts

$28.126

10k+ parts

-

1,727

$31.251

$29.688

$28.126

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One Stop Electronics

USA . 1,083 parts In-Stock

1+ parts

$61.000

100+ parts

-

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1,083

$61.000

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Corphita

USA . 4,744 parts In-Stock

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4,744

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Overview

Elevate your electronics projects with the SN54LS292FK by Texas Instruments, a high-quality prescaler and multivibrator that offers unmatched performance and reliability. Designed with precision and expertise, this versatile component is ideal for a wide range of applications in various industries. With its advanced technology and military-grade temperature grade, this chip carrier package is sure to exceed your expectations. Experience the value and benefits of Texas Instruments' top-notch engineering with the SN54LS292FK - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability, making it suitable for harsh environments

Surface Mount: YES

Allows for easy installation and compact design

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply for compatibility with various systems

Propagation Delay (tpd): 120 ns

Provides fast signal processing and response times

Maximum Operating Temperature: 125 °C

Ensures product can operate in high temperature conditions

Technology: TTL

Reliable and widely used technology for digital electronics

Technical Specifications

Prescaler & Multivibrators SN54LS292FK attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

SELECTABLE DIVISION RATIO 2 TO THE POWER OF 2 TO 2 TO THE POWER OF 31

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Data/Clock Inputs:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

75 mA

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Minimum fmax:

30 MHz

Trade Compliance

SN54LS292FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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