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74LVC1G123DC-Q100,125

NXP Semiconductors

74LVC1G123DC-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G123DC-Q100,125 is a Prescaler & Multivibrator with Propagation Delay of 20.3ns, suitable for Automotive applications. It operates at a Nominal Voltage of 1.8V and can withstand temperatures from -40 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 26,511 parts In-Stock

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26,511

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Digiode

USA . 3,226 parts In-Stock

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Vyrian

USA . 3,071 parts In-Stock

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3,071

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Anansix

USA . 2,471 parts In-Stock

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Nova Conductors

Japan . 78 parts In-Stock

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78

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,247 parts In-Stock

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$4.000

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One Stop Electronics

USA . 322 parts In-Stock

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$10.000

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322

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AZTECH Wire

Italy . 14,687 parts In-Stock

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$11.578

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Microchip USA

USA . 2,039 parts In-Stock

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$15.511

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Semicontronic

India . 1,330 parts In-Stock

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$28.000

100+ parts

$27.300

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$27.160

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1,330

$28.000

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$27.160

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Corohmni

South Africa . 121 parts In-Stock

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$29.774

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121

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Continental Prestige Electronics

USA . 3,918 parts In-Stock

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Supply Digital

USA . 2,032 parts In-Stock

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Argo Parts USA

USA . 1,296 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

USA . 853 parts In-Stock

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UNI Independent Distributors

Spain . 132 parts In-Stock

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Overview

Unlock the power of precision with the 74LVC1G123DC-Q100,125 by NXP Semiconductors. Designed for automotive applications, this Prescaler & Multivibrator offers unparalleled reliability and performance. With a compact design and wide operating temperature range, this product is ideal for demanding environments. Trust NXP Semiconductors to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the 74LVC1G123DC-Q100,125 and experience the difference today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and lightweight, making the product suitable for various applications.

Surface Mount:

YES - Allows for easy installation on circuit boards, saving time and effort during assembly.

Screening Level:

AEC-Q100 - Ensures high reliability and quality standards, making it ideal for automotive applications.

Package Shape:

RECTANGULAR - Provides a compact and efficient design for space-constrained environments.

Nominal Supply Voltage (Vsup):

1.8 V - Works efficiently at a low voltage, reducing power consumption and heat generation.

No. of Terminals:

8 - Sufficient number of terminals for flexibility in connectivity and functionality.

Package Style:

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - Enables a slim and sleek design for modern devices.

Propagation Delay (tpd):

20.3 ns - Offers fast signal processing, suitable for applications requiring quick response times.

Maximum Operating Temperature:

125 °C - Can withstand high temperatures, suitable for demanding environments.

Minimum Operating Temperature:

40 °C - Operates reliably in cold conditions, making it versatile for various climates.

No. of Data/Clock Inputs:

2 - Sufficient inputs for data processing and clock synchronization in electronic systems.

Terminal Position:

DUAL - Provides multiple terminal positions for versatile connectivity options.

Maximum Seated Height:

1 mm - Low profile design for fitting into compact spaces within devices.

Width:

2 mm - Slim width for efficient use of board space in electronic assemblies.

Output Polarity:

TRUE - Provides accurate signal output for reliable data processing.

Minimum Supply Voltage (Vsup):

1.65 V - Works efficiently even at very low voltages, conserving power.

Length:

2.3 mm - Compact length for space-saving integration in electronic systems.

Temperature Grade:

AUTOMOTIVE - Designed to meet automotive industry standards for performance and durability.

Technology:

CMOS - Utilizes CMOS technology for efficient power usage and high-speed operation.

Terminal Form:

GULL WING - Ensures easy soldering and secure connections on circuit boards.

Terminal Pitch:

0.5 mm - Fine pitch for precise connections and compact board layout.

Maximum Supply Voltage (Vsup):

5.5 V - Can handle higher voltage levels for versatile applications.

Technical Specifications

Prescaler & Multivibrators 74LVC1G123DC-Q100,125 attributes and parameters. Explore more Prescaler & Multivibrators devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

Length:

2.3 mm

Logic IC Type:

No. of Data/Clock Inputs:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

20.3 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

74LVC1G123DC-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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