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SN54HC04VTDE1

Texas Instruments

SN54HC04VTDE1 by Texas Instruments

SN54HC04VTDE1 by Texas Instruments is a CMOS logic gate with 6 functions. It comes in a rectangular uncase chip package with 14 terminals, suitable for surface mount applications. With dimensions of 0.889mm width and 1.016mm length, it is commonly used in digital circuit design for signal processing and control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,763 parts In-Stock

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Digiode

USA . 991 parts In-Stock

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991

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Distributors (Availability)

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AZTECH Wire

Italy . 706 parts In-Stock

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$11.744

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706

$11.744

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Parana Technologies

USA . 2,036 parts In-Stock

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$23.385

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$24.019

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2,036

$23.385

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DigiPath Technology Company

USA . 445 parts In-Stock

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$25.750

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$23.690

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445

$25.750

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ChromeModa Solutions

Germany . 3,064 parts In-Stock

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$26.275

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$21.546

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$26.275

$21.546

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IDEA Electronic Components Group

UK . 772 parts In-Stock

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$26.275

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$24.961

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$23.648

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772

$26.275

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$23.648

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$35.255

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$32.082

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$28.909

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One Stop Electronics

USA . 342 parts In-Stock

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$64.000

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Microchip USA

USA . 2,967 parts In-Stock

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$155.700

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$153.000

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$151.640

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$150.290

2,967

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$153.000

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$150.290

Corphita

USA . 4,616 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Overview

Texas Instruments' SN54HC04VTDE1 offers top-notch quality and reliability in the realm of logic gates. With Texas Instruments' reputation for excellence in manufacturing, this product guarantees superior performance and durability. Ideal for a wide range of applications, this logic gate provides seamless integration and functionality. Customers can trust in the value and benefits that this product brings, ensuring efficiency and precision in their projects. Experience the advantages of Texas Instruments' SN54HC04VTDE1 and take your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space.

No. of Functions: 6

Having multiple functions in one component can simplify circuit design and reduce the number of separate components required.

Package Shape: RECTANGULAR

Rectangular packages are typically easy to handle and mount, providing a stable and secure placement on the circuit board.

No. of Terminals: 14

Having more terminals allows for versatile connectivity options and potential integration with other components.

Package Style (Meter): UNCASED CHIP

Uncased chip packages are compact and space-saving, suitable for applications where size is a crucial factor.

Terminal Position: UPPER

Having terminals on the upper side simplifies the soldering and connection process during installation on the circuit board.

Width: 0.889 mm

The narrow width makes this product suitable for compact electronic devices and tight spacing on circuit boards.

Length: 1.016 mm

The small length dimension allows for a space-efficient placement on the circuit board, ideal for miniaturized electronic devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it a reliable choice for logic gate applications.

Terminal Form: NO LEAD

Lead-free terminals contribute to environmentally friendly manufacturing processes and eliminate the risk of lead contamination.

Packing Method: TUBE

Packaging in tubes allows for easy handling, storage, and transportation of the components, reducing the chances of damage or loss.

Technical Specifications

Logic Gates SN54HC04VTDE1 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-XUUC-N14

Length:

1.016 mm

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.889 mm

Trade Compliance

SN54HC04VTDE1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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