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SN54165W-00

Texas Instruments

SN54165W-00 by Texas Instruments

SN54165W-00 by Texas Instruments is an 8-bit digital shift register with a 31 ns propagation delay and operates b/w -55 to 125 °C. Ideal for military applications, it features a 5V nominal voltage, 15 pF load capacitance, and supports surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,954 parts In-Stock

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4,954

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Digiode

USA . 4,688 parts In-Stock

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4,688

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Distributors (Availability)

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AZTECH Wire

Italy . 504 parts In-Stock

1+ parts

$10.582

100+ parts

-

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504

$10.582

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Parana Technologies

USA . 296 parts In-Stock

1+ parts

$29.152

100+ parts

-

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$56.077

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296

$29.152

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$56.077

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DigiPath Technology Company

USA . 417 parts In-Stock

1+ parts

$32.100

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417

$32.100

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ChromeModa Solutions

Germany . 5,926 parts In-Stock

1+ parts

$32.755

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$26.859

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5,926

$32.755

$26.859

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IDEA Electronic Components Group

UK . 2,377 parts In-Stock

1+ parts

$32.755

100+ parts

$31.117

1k+ parts

$29.480

10k+ parts

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2,377

$32.755

$31.117

$29.480

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One Stop Electronics

USA . 502 parts In-Stock

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$44.000

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502

$44.000

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Corphita

USA . 4,093 parts In-Stock

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4,093

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Overview

Unlock the power of digital shift registers with the Texas Instruments SN54165W-00. Manufactured by a trusted industry leader, this versatile component offers exceptional quality and reliability. Ideal for a wide range of applications, this 8-bit shift register delivers superior performance with a nominal supply voltage of 5V and a fast propagation delay of 31ns. Whether you're designing consumer electronics or industrial automation systems, this innovative product provides unmatched value, benefits, and advantages to meet your unique needs. Explore endless possibilities with the Texas Instruments SN54165W-00.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring the product can withstand harsh environmental conditions.

No. of Bits: 8

Offers a sufficient number of bits for various digital applications, providing flexibility and versatility.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply systems, making it easy to integrate into existing setups.

Propagation Delay (tpd): 31 ns

Fast propagation delay ensures quick data transfer, enhancing the overall performance of the shift register.

Temperature Grade: MILITARY

Suitable for military-grade applications where reliability and robustness are essential.

Minimum fmax: 26 MHz

High maximum frequency allows for fast data processing and transmission, making it ideal for applications requiring quick response times.

Technical Specifications

Digital Shift Registers SN54165W-00 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

CLOCK INHIBIT

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

63 mA

Propagation Delay (tpd):

31 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.73 mm

Minimum fmax:

26 MHz

Trade Compliance

SN54165W-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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