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SN54165J-00

Texas Instruments

SN54165J-00 by Texas Instruments

SN54165J-00 by Texas Instruments is an 8-bit digital shift register with a supply voltage of 5V and propagation delay of 31ns. It is used in military-grade applications, featuring a temperature range from -55°C to 125°C. The package style is in-line with through-hole terminals, making it suitable for high-speed data processing at up to 26MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,735 parts In-Stock

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Digiode

USA . 2,428 parts In-Stock

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2,428

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Distributors (Availability)

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AZTECH Wire

Italy . 449 parts In-Stock

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$17.597

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$17.597

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One Stop Electronics

USA . 1,421 parts In-Stock

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$18.000

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Parana Technologies

USA . 2,189 parts In-Stock

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$23.693

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$24.317

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$23.693

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DigiPath Technology Company

USA . 758 parts In-Stock

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$26.089

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$24.001

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758

$26.089

$24.001

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ChromeModa Solutions

Germany . 6,388 parts In-Stock

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$26.621

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$21.829

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$26.621

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IDEA Electronic Components Group

UK . 2,343 parts In-Stock

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$26.621

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$25.290

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$23.959

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Corphita

USA . 4,867 parts In-Stock

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Overview

Elevate your digital shift register game with the Texas Instruments SN54165J-00. Crafted with precision and expertise by a trusted industry leader, this ceramic, glass-sealed marvel offers unparalleled performance and reliability. Perfect for military-grade applications, this 8-bit shift register boasts a fast propagation delay of 31 ns and a maximum operating temperature of 125°C. Say goodbye to inefficiency and hello to seamless data processing with the SN54165J-00 - the ultimate solution for your digital circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and protection for the shift register, making it reliable for long-term use.

No. of Bits: 8

Offers sufficient capacity for processing data in various applications without being too complex or over-engineered.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power sources, making it easy to integrate into different systems or circuits.

Propagation Delay (tpd): 31 ns

Provides fast data transfer speeds, ensuring efficient performance in time-critical applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for environments where heat may be a factor.

Technology: TTL

Uses TTL technology known for its reliability and simplicity, making it a trusted choice in digital applications.

Technical Specifications

Digital Shift Registers SN54165J-00 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

CLOCK INHIBIT

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

63 mA

Propagation Delay (tpd):

31 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

26 MHz

Trade Compliance

SN54165J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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