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SBP9960CJ

Texas Instruments

SBP9960CJ by Texas Instruments

The Texas Instruments SBP9960CJ is a 28-terminal parallel I/O port with ceramic package. Operating temperature range of 0-70°C, suitable for commercial applications. Features bipolar technology and through-hole terminals with 2.54mm pitch, ideal for various electronic projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,982 parts In-Stock

1+ parts

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5,982

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Digiode

USA . 3,730 parts In-Stock

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3,730

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 499 parts In-Stock

1+ parts

$5.283

100+ parts

-

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499

$5.283

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One Stop Electronics

USA . 579 parts In-Stock

1+ parts

$9.000

100+ parts

-

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579

$9.000

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Parana Technologies

USA . 2,061 parts In-Stock

1+ parts

$62.197

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2,061

$62.197

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Corohmni

South Africa . 40 parts In-Stock

1+ parts

$62.722

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40

$62.722

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DigiPath Technology Company

USA . 2,294 parts In-Stock

1+ parts

$68.486

100+ parts

$63.007

1k+ parts

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2,294

$68.486

$63.007

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ChromeModa Solutions

Germany . 2,656 parts In-Stock

1+ parts

$69.884

100+ parts

$57.305

1k+ parts

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2,656

$69.884

$57.305

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IDEA Electronic Components Group

UK . 1,400 parts In-Stock

1+ parts

$69.884

100+ parts

$66.390

1k+ parts

$62.896

10k+ parts

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1,400

$69.884

$66.390

$62.896

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Corphita

USA . 3,039 parts In-Stock

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3,039

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Overview

Unlock limitless possibilities with the SBP9960CJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. The SBP9960CJ falls under the category of Parallel I/O Ports, making it a versatile solution for various applications. With its ceramic body material and dual terminal position, this product ensures optimal performance even in demanding environments. Experience the value and benefits of Texas Instruments' innovation with the SBP9960CJ, providing customers with a competitive edge in their projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a high quality and durable material that provides excellent thermal conductivity, making it ideal for electronic components that require heat dissipation.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and easy placement on circuit boards, maximizing space utilization.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and versatility in usage.

Package Style (Meter): IN-LINE

In-line package style makes it easy to integrate the component into existing setups and connect with other devices in a linear manner.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures, providing reliability in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0°C ensures functionality in colder conditions without any issues.

Terminal Position: DUAL

Dual terminal position allows for improved stability and better connectivity, reducing the risk of signal loss or interference.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this product is suitable for typical commercial applications, offering a cost-effective solution for various projects.

Technology: BIPOLAR

Bipolar technology ensures fast and efficient signal processing, making this product suitable for high-speed data transfer requirements.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections, making it easier to solder and mount the component onto circuit boards.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product offers compatibility with standard PCB layouts and components, simplifying the integration process.

Technical Specifications

Parallel I/O Ports SBP9960CJ attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T28

No. of Bits:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SBP9960CJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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