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RM44L920APGET

Texas Instruments

RM44L920APGET by Texas Instruments

Texas Instruments RM44L920APGET microcontroller features 32-bit CPU CORTEX-R4F with 1048576 ROM words. It offers 24-Ch 12-Bit ADC, 64K Data EEPROM, and peripherals like DMA(16) and PWM(14). Ideal for industrial applications requiring high-speed processing up to 80 MHz with a temperature range of -40 to 105 °C.

Median Price

$27.440

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 590 parts In-Stock

1+ parts

$16.897

100+ parts

$14.760

1k+ parts

$10.179

10k+ parts

-

590

$16.897

$14.760

$10.179

-

DigiKey

USA . 547 parts In-Stock

1+ parts

$27.440

100+ parts

$19.804

1k+ parts

$18.173

10k+ parts

-

547

$27.440

$19.804

$18.173

-

Mouser Electronics

USA . 93 parts In-Stock

1+ parts

$27.440

100+ parts

$19.810

1k+ parts

$18.510

10k+ parts

-

93

$27.440

$19.810

$18.510

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,078 parts In-Stock

1+ parts

$16.052

100+ parts

-

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-

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2,078

$16.052

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-

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$16.856

100+ parts

-

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600

$16.856

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Vyrian

USA . 2,921 parts In-Stock

1+ parts

-

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2,921

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,155 parts In-Stock

1+ parts

$15.207

100+ parts

-

1k+ parts

-

10k+ parts

-

2,155

$15.207

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-

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Continental Prestige Electronics

USA . 4,465 parts In-Stock

1+ parts

$15.452

100+ parts

-

1k+ parts

-

10k+ parts

$15.143

4,465

$15.452

-

-

$15.143

Netroflash

USA . 50 parts In-Stock

1+ parts

$16.856

100+ parts

-

1k+ parts

$16.014

10k+ parts

$15.676

50

$16.856

-

$16.014

$15.676

Parana Technologies

USA . 1,877 parts In-Stock

1+ parts

$18.296

100+ parts

$1,699.036

1k+ parts

$16.466

10k+ parts

-

1,877

$18.296

$1,699.036

$16.466

-

DigiPath Technology Company

USA . 1,454 parts In-Stock

1+ parts

$20.146

100+ parts

$18.534

1k+ parts

-

10k+ parts

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1,454

$20.146

$18.534

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IDEA Electronic Components Group

UK . 1,545 parts In-Stock

1+ parts

$20.557

100+ parts

$19.529

1k+ parts

$18.501

10k+ parts

-

1,545

$20.557

$19.529

$18.501

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ChromeModa Solutions

Germany . 106 parts In-Stock

1+ parts

$20.557

100+ parts

$16.857

1k+ parts

-

10k+ parts

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106

$20.557

$16.857

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Ampacity Inc.

Singapore . 391 parts In-Stock

1+ parts

$31.260

100+ parts

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391

$31.260

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Microchip USA

USA . 2,675 parts In-Stock

1+ parts

$55.550

100+ parts

$54.760

1k+ parts

$54.360

10k+ parts

$53.960

2,675

$55.550

$54.760

$54.360

$53.960

QUARKTWIN TECHNOLOGY LTD

USA . 20,747 parts In-Stock

1+ parts

-

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20,747

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Argo Parts USA

USA . 2,836 parts In-Stock

1+ parts

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2,836

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Futuretech Components

Singapore . 277 parts In-Stock

1+ parts

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277

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Overview

Experience the cutting-edge technology of Texas Instruments with the RM44L920APGET microcontroller. This high-quality device offers a wide range of applications in various industries, providing unmatched performance and reliability. With its advanced features and innovative design, customers can benefit from improved efficiency, increased functionality, and seamless connectivity. Trust in Texas Instruments to deliver superior products that meet your needs and exceed your expectations. Elevate your projects with the RM44L920APGET microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and reliability for the package, ensuring the safety of the microcontroller.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly onto PCBs, saving time and effort during production.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power options, accommodating a wider range of applications.

Package Shape: SQUARE

Square shape helps in efficient space utilization on the PCB, especially in compact designs.

Bit Size: 32

32-bit architecture enables faster processing and higher performance compared to lower bit microcontrollers.

No. of Terminals: 144

Higher number of terminals allows for more I/O options and connectivity, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design with fine pitch terminals makes the microcontroller suitable for compact and densely populated PCB layouts.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage ensures efficient power consumption and operation at lower energy levels, potentially extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range allows the microcontroller to perform reliably in harsh environmental conditions without overheating.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family offers high performance real-time processing capabilities suitable for applications requiring precise timing and responsiveness.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range enables the microcontroller to function effectively in cold environments without performance degradation.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to accurately convert analog signals to digital data, essential for a wide range of sensing and measurement applications.

DMA Channels: YES

DMA channels improve data transfer efficiency and reduce CPU workload, allowing for faster and more efficient data processing.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for reliable terminal connections.

ROM Words: 1048576

Large ROM capacity allows for storing a significant amount of program code and data, facilitating the development of complex applications and algorithms.

Maximum Seated Height: 1.6 mm

Low seated height makes the microcontroller suitable for ultra-thin device designs where space is limited.

Width: 20 mm

Compact width dimension enables easy integration into various product designs without occupying excessive space.

Data EEPROM Size: 64K

Large data EEPROM size provides ample storage space for non-volatile data, configurations, and user settings.

Peripherals: DMA(16), POR, PWM(14), TIMER(41), WDT

Various peripherals such as DMA, POR, PWM, Timer, and WDT enhance the microcontroller's capability to interface with external devices and perform versatile functions.

Maximum Clock Frequency: 80 MHz

High clock frequency allows for fast execution of instructions and high-speed data processing, suitable for demanding real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and assembly reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance makes the microcontroller suitable for lead-free soldering processes and high-temperature reflow conditions.

Length: 20 mm

Optimal length dimension accommodates various PCB layouts and form factors, offering flexibility in product design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the microcontroller's stable operation in challenging industrial environments with temperature variations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller design make this product suitable for applications requiring efficient data processing, low power consumption, and real-time control.

RAM Bytes: 131072

Generous RAM size provides ample space for data storage and efficient access for processing tasks, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form ensures reliable solder joints and mechanical strength for stable connectivity during PCB assembly and operation.

Analog To Digital Convertors: 24-Ch 12-Bit

24-channel 12-bit ADCs provide high-resolution analog-to-digital conversion capability for accurate sensor data acquisition and processing.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations that could affect performance.

PWM Channels: YES

PWM channels enable precise control of digital signals for applications such as motor control, lighting, and power management, enhancing the microcontroller's versatility.

Connectivity: I2C, SPI

Support for I2C and SPI connectivity protocols allows the microcontroller to communicate with a wide range of external devices, enabling seamless integration into diverse systems.

ROM Programmability: FLASH

Flash programmability offers the flexibility to reprogram the microcontroller's memory content multiple times, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting of the microcontroller on PCBs, optimizing space usage and allowing for small footprint designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture exposure during storage and solder reflow processes, requiring standard handling precautions.

Speed: 180 rpm

High operating speed of 180 rpm ensures swift execution of tasks and efficient performance in time-critical applications.

On Chip Program ROM Width: 8

On-chip 8-bit program ROM width provides efficient storage and retrieval of program instructions, enhancing the microcontroller's processing speed.

No. of I/O Lines: 64

Abundance of I/O lines allows for versatile input and output configurations, facilitating communication with external devices and interfaces.

Technical Specifications

Microcontrollers RM44L920APGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

I2C, SPI

Peripherals:

DMA(16), POR, PWM(14), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM44L920APGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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