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PTMP235QDCKRQ1

Texas Instruments

PTMP235QDCKRQ1 by Texas Instruments

PTMP235QDCKRQ1 by Texas Instruments is a temperature sensor with a max supply voltage of 5.5V and AEC-Q100 screening level. With a nominal output current of 500uA, it is ideal for automotive applications requiring precise temperature monitoring in compact spaces. This rectangular sensor has a high accuracy of 2.50°C and is designed for surface mount installation in plastic housings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,213 parts In-Stock

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Digiode

USA . 873 parts In-Stock

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873

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Parana Technologies

USA . 1,405 parts In-Stock

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$2.922

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$3.420

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$2.922

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$3.420

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DigiPath Technology Company

USA . 1,742 parts In-Stock

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$3.217

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$3.217

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ChromeModa Solutions

Germany . 1,760 parts In-Stock

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$3.283

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$2.692

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IDEA Electronic Components Group

UK . 874 parts In-Stock

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$3.283

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$2.955

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874

$3.283

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$2.955

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AZTECH Wire

Italy . 249 parts In-Stock

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$18.667

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One Stop Electronics

USA . 449 parts In-Stock

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$22.750

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$22.750

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Ampacity Inc.

Singapore . 203 parts In-Stock

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$31.750

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Semicontronic

India . 1,645 parts In-Stock

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$33.750

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$32.906

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$32.738

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Corphita

USA . 2,966 parts In-Stock

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Corohmni

South Africa . 345 parts In-Stock

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Overview

Experience superior temperature sensing with the PTMP235QDCKRQ1 by Texas Instruments, a top-quality manufacturer known for its cutting-edge technology and reliable products. This temperature sensor offers unparalleled accuracy and performance in a compact rectangular package, making it ideal for a wide range of applications. From automotive to industrial settings, this sensor provides precise voltage output and easy surface mount installation. Trust Texas Instruments to deliver exceptional value and innovation with the PTMP235QDCKRQ1.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Allows for versatile usage with a wide range of systems without the risk of voltage overload.

Screening Level: AEC-Q100

Ensures high reliability and quality, making it suitable for automotive applications where durability is key.

Body Width: 1.25 inch

Compact size allows for easy integration into various devices and systems.

Sensors or Transducers Type: TEMPERATURE SENSOR, ANALOG, VOLTAGE OUTPUT

Provides accurate temperature readings with analog voltage output for compatibility with a wide range of systems.

Body Height: 1.1 mm

Low profile design facilitates installation in tight spaces or on small circuit boards.

Package Shape or Style: RECTANGULAR

Simplifies the mounting process and ensures a secure fit within the device.

Minimum Supply Voltage: 2.3 V

Operates efficiently with low voltage input while still delivering reliable performance.

Nominal Output Current: 500 uA

Provides a consistent output current for accurate temperature readings.

Housing: PLASTIC

Lightweight and durable housing material that offers protection to the internal components.

Maximum Accuracy °C: 2.50

Delivers precise temperature measurements with a low margin of error.

Body Length/Diameter: 2 mm

Compact size allows for easy integration into various devices and systems.

Termination Type: SOLDER

Secure termination type for reliable connection within the system.

Mounting Feature: SURFACE MOUNT

Easily mounts onto the surface of a PCB for quick and efficient installation.

Technical Specifications

Temperature Sensors PTMP235QDCKRQ1 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

2.50

Additional Features:

AEC-Q100

Body Width:

1.25 inch

Body Height:

1.1 mm

Body Length/Diameter:

2 mm

Housing:

PLASTIC

Mounting Feature:

Nominal Output Current:

500 uA

Package Shape or Style:

Screening Level:

AEC-Q100

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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