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PTMP235QDBZTQ1

Texas Instruments

PTMP235QDBZTQ1 by Texas Instruments

PTMP235QDBZTQ1 by Texas Instruments is a temperature sensor with a voltage output. It operates b/w -40 to 125°C, with an accuracy of ±2.50°C. Suitable for automotive applications due to AEC-Q100 screening and compact rectangular package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,448 parts In-Stock

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Digiode

USA . 2,719 parts In-Stock

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Semicontronic

India . 718 parts In-Stock

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$0.750

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$0.731

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$0.728

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718

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Parana Technologies

USA . 2,210 parts In-Stock

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$2.357

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$2.856

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DigiPath Technology Company

USA . 520 parts In-Stock

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$2.595

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IDEA Electronic Components Group

UK . 1,858 parts In-Stock

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$2.648

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$2.383

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ChromeModa Solutions

Germany . 1,104 parts In-Stock

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$2.648

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$2.171

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AZTECH Wire

Italy . 436 parts In-Stock

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$13.847

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One Stop Electronics

USA . 677 parts In-Stock

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$19.750

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Ampacity Inc.

Singapore . 455 parts In-Stock

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Corphita

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Corohmni

South Africa . 107 parts In-Stock

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Overview

Experience precision and reliability with the PTMP235QDBZTQ1 from Texas Instruments. As a leading manufacturer in temperature sensors, this device offers unparalleled accuracy and performance for a wide range of applications. Whether you need to monitor temperature in automotive systems, industrial processes, or consumer electronics, this sensor provides exceptional value with its high-quality design and AEC-Q100 screening level. Trust Texas Instruments to deliver innovative solutions that meet your needs with the PTMP235QDBZTQ1.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for flexibility in power source selection and compatibility with a wide range of systems.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards for automotive applications.

Body Width: 1.3 inch

Compact design with a small footprint allows for easy integration into tight spaces or PCB layouts.

Sensors or Transducers Type: TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT

Analog voltage output provides a continuous and precise temperature measurement for accurate monitoring.

Maximum Operating Temperature: 125 °C

Wide operating temperature range enables reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low operating temperature allows for use in cold environments without affecting sensor accuracy.

Housing: PLASTIC

Plastic housing offers lightweight and durable protection for the sensor, making it suitable for different applications.

Maximum Accuracy °C: 2.50

High accuracy ensures precise temperature measurements for critical systems or processes.

Termination Type: SOLDER

Solder termination provides a reliable electrical connection for seamless integration into electronic circuits.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies the installation process and offers flexibility in mounting options.

Technical Specifications

Temperature Sensors PTMP235QDBZTQ1 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

2.50

Additional Features:

AEC-Q100

Body Width:

1.3 inch

Body Height:

1.12 mm

Body Length/Diameter:

2.92 mm

Housing:

PLASTIC

Mounting Feature:

Maximum Operating Current:

.0145 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Current:

500 uA

Package Shape or Style:

Screening Level:

AEC-Q100

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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