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PTMP126EDBVTQ1

Texas Instruments

PTMP126EDBVTQ1 by Texas Instruments

PTMP126EDBVTQ1 by Texas Instruments is a temperature sensor with 14-bit resolution, AEC-Q100 screening, and 3-wire interface. It operates b/w -55 to 175°C, suitable for automotive applications due to its surface mounting feature and high accuracy of 0.75°C.

Median Price

$8.400

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 81 parts In-Stock

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$8.400

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$6.132

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Vyrian

USA . 5,178 parts In-Stock

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Digiode

USA . 4,539 parts In-Stock

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Microfarads

USA . 87 parts In-Stock

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Parana Technologies

USA . 301 parts In-Stock

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$2.465

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$2.958

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301

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DigiPath Technology Company

USA . 952 parts In-Stock

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$2.715

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$2.497

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952

$2.715

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ChromeModa Solutions

Germany . 4,385 parts In-Stock

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$2.770

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$2.271

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IDEA Electronic Components Group

UK . 986 parts In-Stock

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$2.770

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$2.493

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986

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AZTECH Wire

Italy . 525 parts In-Stock

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$7.405

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One Stop Electronics

USA . 1,107 parts In-Stock

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$25.750

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Corphita

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Overview

Discover the ultimate solution for precise temperature sensing with the PTMP126EDBVTQ1 by Texas Instruments. Boasting top-notch quality and reliability, this sensor is perfect for a wide range of applications. Whether you're looking to monitor equipment temperatures or regulate HVAC systems, this versatile sensor delivers accurate readings with ease. Trust in Texas Instruments' reputation for excellence and innovation, and experience the unbeatable value and benefits that the PTMP126EDBVTQ1 offers. Stay ahead of the curve with this cutting-edge temperature sensor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the temperature sensor, making it suitable for various environments and applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this temperature sensor can be used in systems that require higher voltage levels without risk of damage.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures that the temperature sensor meets automotive industry standards for reliability and performance in harsh conditions.

No. of Bits: 14

Having 14 bits allows for a higher resolution in temperature readings, providing more accurate and precise data for applications that require detailed temperature monitoring.

Body Width: 1.6 inch

Compact body width enables easy integration of the temperature sensor into smaller devices or systems where space is limited.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

This multi-functional sensor can not only measure temperature but also provide digital outputs and serial communication capabilities, offering versatility in various applications.

No. of Terminals: 6

Having 6 terminals allows for easy connection and integration of the temperature sensor into electronic circuits or systems.

Body Height: 1.1 mm

Low body height makes the temperature sensor suitable for applications where space is limited or where a slim profile is desired.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides easy mounting and installation options for the temperature sensor in different configurations or setups.

Minimum Supply Voltage: 1.62 V

Low minimum supply voltage ensures that the temperature sensor can operate efficiently even in systems with lower voltage levels, conserving power consumption.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance allows the temperature sensor to be used in environments where temperatures can reach high levels without affecting performance.

Minimum Operating Temperature: -55 °C

Wide range of minimum operating temperature enables the temperature sensor to function accurately even in extremely low-temperature conditions.

Maximum Operating Current: 0.0012 mA

With a low maximum operating current, the temperature sensor consumes minimal power during operation, making it energy-efficient and suitable for battery-powered devices.

Maximum Accuracy °C: 0.75

High accuracy of 0.75°C ensures precise temperature measurements, making the sensor reliable for critical applications where accuracy is crucial.

Body Length/Diameter: 2.9 mm

Compact body length or diameter allows for easy placement and mounting of the temperature sensor in tight spaces or on small circuit boards.

Termination Type: SOLDER

Solder termination type provides a secure and reliable connection for the temperature sensor, ensuring stable performance over time and under varying conditions.

Output Interface Type: 3-WIRE INTERFACE

3-wire interface type offers a standardized communication protocol for connecting the temperature sensor to other systems or devices, facilitating easy data exchange.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure installation of the temperature sensor on PCBs or other surfaces, enhancing convenience and reliability of the sensor.

Technical Specifications

Temperature Sensors PTMP126EDBVTQ1 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

0.75

Body Width:

1.6 inch

Body Height:

1.1 mm

Body Length/Diameter:

2.9 mm

Mounting Feature:

No. of Bits:

14

No. of Terminals:

6

Maximum Operating Current:

.0012 mA

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

3-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSOP6,.11,37

Package Shape or Style:

Screening Level:

AEC-Q100

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.62 V

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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