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PT4302C

Texas Instruments

PT4302C by Texas Instruments

DC-DC REGULATED POWER SUPPLY MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,947 parts In-Stock

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Digiode

USA . 2,039 parts In-Stock

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2,039

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 300 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

300

$2.500

$2.438

$2.425

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Parana Technologies

USA . 496 parts In-Stock

1+ parts

$5.182

100+ parts

-

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$5.786

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496

$5.182

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$5.786

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DigiPath Technology Company

USA . 312 parts In-Stock

1+ parts

$5.707

100+ parts

$5.250

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312

$5.707

$5.250

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ChromeModa Solutions

Germany . 3,767 parts In-Stock

1+ parts

$5.823

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$4.775

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3,767

$5.823

$4.775

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IDEA Electronic Components Group

UK . 1,610 parts In-Stock

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$5.823

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$5.241

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1,610

$5.823

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$5.241

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One Stop Electronics

USA . 258 parts In-Stock

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$6.500

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258

$6.500

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Ampacity Inc.

Singapore . 485 parts In-Stock

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$7.500

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485

$7.500

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AZTECH Wire

Italy . 364 parts In-Stock

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$17.983

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364

$17.983

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Corphita

USA . 4,544 parts In-Stock

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Corohmni

South Africa . 407 parts In-Stock

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Kepictronics

USA . 37 parts In-Stock

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Technical Specifications

Power Supply Modules PT4302C attributes and parameters. Explore more Power Supply Modules devices from Texas Instruments

Specs

Additional Features:

ADDITIONAL 3.3V OUTPUT AVAILABLE

Maximum Input Voltage:

72 V

Minimum Input Voltage:

38 V

Nominal Input Voltage:

48 V

JESD-30 Code:

R-XDSO-G18

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

3.432 V

Minimum Output Voltage:

3.168 V

Nominal Output Voltage:

5.2 V

Package Body Material:

UNSPECIFIED

Package Code:

SOP

Package Equivalence Code:

GWDIP18,1.1,200

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

8.1 mm

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Technology:

HYBRID

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

YES

Trade Compliance

PT4302C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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