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PLM74721QDRRRQ1

Texas Instruments

PLM74721QDRRRQ1 by Texas Instruments

PLM74721QDRRRQ1 by Texas Instruments is a Power Management IC with AEC-Q100 screening. It has 12 terminals, supports supply voltage from 3V to 65V, and operates b/w -40°C to 125°C. Ideal for automotive applications due to its small outline package and adjustable threshold feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 8,858 parts In-Stock

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Digiode

USA . 3,227 parts In-Stock

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Classic Components Corporation

USA . 800 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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Bristol Electronics

USA . 28 parts In-Stock

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One Stop Electronics

USA . 129 parts In-Stock

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$2.500

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Ampacity Inc.

Singapore . 619 parts In-Stock

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AZTECH Wire

Italy . 774 parts In-Stock

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Parana Technologies

USA . 1,216 parts In-Stock

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$16.494

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DigiPath Technology Company

USA . 1,649 parts In-Stock

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$18.162

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$16.709

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ChromeModa Solutions

Germany . 3,961 parts In-Stock

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$18.533

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$15.197

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IDEA Electronic Components Group

UK . 21 parts In-Stock

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$17.606

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Continental Prestige Electronics

USA . 3,439 parts In-Stock

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Argo Parts USA

USA . 3,315 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Corphita

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Overview

Experience the unparalleled quality and reliability of Texas Instruments' PLM74721QDRRRQ1 Power Management IC. Designed for a wide range of applications, this innovative product offers customers superior performance and efficiency. With advanced features such as an adjustable threshold and a small outline package style, this IC provides unmatched value and benefits to users. Trust in Texas Instruments to deliver cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good protection for the internal components of the IC, ensuring durability and reliability.

Surface Mount: YES

Being surface mountable makes it easy to integrate this Power Management IC into circuit boards, saving space and allowing for efficient assembly.

Nominal Supply Voltage (Vsup): 12 V

With a nominal supply voltage of 12V, this IC is suitable for various applications requiring a stable power source at this voltage level.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that the IC can withstand elevated temperatures without degradation, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the IC to function reliably in cold environments, expanding its range of usability.

Terminal Position: DUAL

The dual terminal position provides flexibility in the orientation of the IC during installation, making it easier to accommodate in different circuit layouts.

Nominal Threshold Voltage (V): +3.4V

The nominal threshold voltage of +3.4V ensures precise voltage regulation, helping to maintain stable power output in various applications.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V allows the IC to operate efficiently even at low power supply levels, making it versatile for different voltage input scenarios.

Maximum Supply Voltage (Vsup): 65 V

The high maximum supply voltage of 65V enables the IC to handle higher voltage inputs, expanding its compatibility with a wide range of power sources.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of the threshold voltage, offering flexibility in power management settings based on specific application requirements.

Technical Specifications

Power Management ICs PLM74721QDRRRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-N12

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC12,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, EXTREMELY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

65 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.4V

Width (mm):

3 mm

Trade Compliance

PLM74721QDRRRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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