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PGA113AIDGSTG4

Texas Instruments

PGA113AIDGSTG4 by Texas Instruments

PGA113AIDGSTG4 by Texas Instruments is a 10-terminal analog circuit IC with dual terminal position. It operates at -40 to 125 °C and requires 2.2-5.5 V supply voltage, drawing a max of 1.2 mA current. Ideal for automotive applications due to its small outline package style and moisture sensitivity level of 2.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,275 parts In-Stock

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6,275

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Digiode

USA . 4,249 parts In-Stock

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4,249

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Nova Conductors

Japan . 49 parts In-Stock

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49

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Distributors (Availability)

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Ampacity Inc.

Singapore . 389 parts In-Stock

1+ parts

$2.500

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389

$2.500

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One Stop Electronics

USA . 301 parts In-Stock

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$4.500

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301

$4.500

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Semicontronic

India . 1,392 parts In-Stock

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$5.500

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$5.362

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$5.335

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1,392

$5.500

$5.362

$5.335

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Parana Technologies

USA . 507 parts In-Stock

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$6.101

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$6.878

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507

$6.101

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$6.878

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AZTECH Wire

Italy . 244 parts In-Stock

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$6.273

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244

$6.273

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ChromeModa Solutions

Germany . 3,060 parts In-Stock

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$6.855

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$5.621

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3,060

$6.855

$5.621

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IDEA Electronic Components Group

UK . 1,916 parts In-Stock

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$6.855

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$6.170

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1,916

$6.855

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$6.170

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Corohmni

South Africa . 77 parts In-Stock

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$12.480

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77

$12.480

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Argo Parts USA

USA . 4,034 parts In-Stock

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Microchip USA

USA . 2,457 parts In-Stock

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DigiPath Technology Company

USA . 1,653 parts In-Stock

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$6.180

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$6.180

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Corphita

USA . 999 parts In-Stock

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999

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Advanced Electronics

New Zealand . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Continental Prestige Electronics

USA . 354 parts In-Stock

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354

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Overview

Experience top-of-the-line quality and reliability with the PGA113AIDGSTG4 by Texas Instruments. As a leading manufacturer in the semiconductor industry, Texas Instruments brings you a product that exceeds expectations in various applications. With its compact design and efficient performance, this analog circuit IC offers unmatched value to customers looking for precision and durability. Trust Texas Instruments to provide you with innovative solutions that enhance your projects and deliver exceptional results. Upgrade to the PGA113AIDGSTG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product suitable for various applications.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

Provides a stable power source to ensure reliable operation of the semiconductor.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in a wide range of environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperatures, making it versatile for various applications.

Moisture Sensitivity Level (MSL): 2

With MSL level 2, the product has moderate sensitivity to moisture, ensuring proper handling and storage.

Technical Specifications

Other Function Semiconductors PGA113AIDGSTG4 attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

1.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

PGA113AIDGSTG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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