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PGA117AIPW

Texas Instruments

PGA117AIPW by Texas Instruments

ANALOG CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$3.961

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,720 parts In-Stock

1+ parts

$4.341

100+ parts

$3.804

1k+ parts

$2.149

10k+ parts

-

20,720

$4.341

$3.804

$2.149

-

Rochester

USA . 37,510 parts In-Stock

1+ parts

-

100+ parts

$3.090

1k+ parts

$2.760

10k+ parts

$2.600

37,510

-

$3.090

$2.760

$2.600

DigiKey

USA . 37,510 parts In-Stock

1+ parts

-

100+ parts

$4.060

1k+ parts

-

10k+ parts

-

37,510

-

$4.060

-

-

Verical

USA . 36,530 parts In-Stock

1+ parts

-

100+ parts

$3.862

1k+ parts

$3.450

10k+ parts

$3.250

36,530

-

$3.862

$3.450

$3.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,948 parts In-Stock

1+ parts

$2.831

100+ parts

-

1k+ parts

-

10k+ parts

-

4,948

$2.831

-

-

-

Vyrian

USA . 4,193 parts In-Stock

1+ parts

$2.980

100+ parts

-

1k+ parts

-

10k+ parts

-

4,193

$2.980

-

-

-

DigiKey Marketplace

USA . 37,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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37,740

-

-

-

-

Chip Stock

USA . 5,000 parts In-Stock

1+ parts

-

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-

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5,000

-

-

-

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ACDS - Activité Composants Distribution Service

France . 122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

122

-

-

-

-

Bristol Electronics

USA . 122 parts In-Stock

1+ parts

-

100+ parts

$2.140

1k+ parts

$1.987

10k+ parts

-

122

-

$2.140

$1.987

-

Dan-Mar Components

USA . 122 parts In-Stock

1+ parts

-

100+ parts

-

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122

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,338 parts In-Stock

1+ parts

$2.682

100+ parts

-

1k+ parts

-

10k+ parts

-

3,338

$2.682

-

-

-

Parana Technologies

USA . 1,006 parts In-Stock

1+ parts

$16.323

100+ parts

-

1k+ parts

$16.626

10k+ parts

-

1,006

$16.323

-

$16.626

-

IDEA Electronic Components Group

UK . 1,070 parts In-Stock

1+ parts

$18.340

100+ parts

$17.423

1k+ parts

$16.506

10k+ parts

-

1,070

$18.340

$17.423

$16.506

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ChromeModa Solutions

Germany . 1,021 parts In-Stock

1+ parts

$18.340

100+ parts

$15.039

1k+ parts

-

10k+ parts

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1,021

$18.340

$15.039

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Lixinc

USA . 14,066 parts In-Stock

1+ parts

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14,066

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

-

-

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DigiPath Technology Company

USA . 437 parts In-Stock

1+ parts

-

100+ parts

$16.535

1k+ parts

-

10k+ parts

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437

-

$16.535

-

-

Technical Specifications

Other Function Semiconductors PGA117AIPW attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

1.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

PGA117AIPW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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