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PDRV5053VAQLPG

Texas Instruments

PDRV5053VAQLPG by Texas Instruments

PDRV5053VAQLPG by Texas Instruments is a Hall effect magnetic field sensor with 2.5-38V supply voltage range, 0-2V analog output, and -40 to 125°C operating temperature. Ideal for applications requiring precise magnetic field detection in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,956 parts In-Stock

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Digiode

USA . 915 parts In-Stock

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Parana Technologies

USA . 329 parts In-Stock

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$2.927

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$3.427

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329

$2.927

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$3.427

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DigiPath Technology Company

USA . 928 parts In-Stock

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$3.223

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$2.965

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928

$3.223

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ChromeModa Solutions

Germany . 2,956 parts In-Stock

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$3.289

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$2.697

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$3.289

$2.697

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IDEA Electronic Components Group

UK . 983 parts In-Stock

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$3.289

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$2.960

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983

$3.289

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$2.960

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AZTECH Wire

Italy . 610 parts In-Stock

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$7.201

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610

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One Stop Electronics

USA . 1,613 parts In-Stock

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$15.750

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$15.750

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Semicontronic

India . 754 parts In-Stock

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$29.750

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$29.006

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$28.858

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$29.750

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Ampacity Inc.

Singapore . 271 parts In-Stock

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$43.750

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Corphita

USA . 4,511 parts In-Stock

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Corohmni

South Africa . 204 parts In-Stock

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Overview

Unleash the power of magnetic field sensing with the PDRV5053VAQLPG by Texas Instruments. As a leader in innovative technology, Texas Instruments delivers top-notch quality and performance in every product. This magnetic field sensor is versatile and reliable, making it ideal for a wide range of applications. From automotive to industrial, this sensor provides accurate data with precision output, ensuring optimal results for your projects. Choose Texas Instruments for superior products that bring value and efficiency to every customer.

Feature Benefit Bullets

Maximum Supply Voltage: 38 V

High maximum supply voltage allows for versatile applications and robust performance.

Body Width: 1.52 inch

Compact size enables easy integration into various electronic devices.

Sensors or Transducers Type: MAGNETIC FIELD SENSOR,HALL EFFECT

Hall effect sensor technology ensures accurate and reliable measurement of magnetic fields.

Body Height: 5.05 mm

Low profile design facilitates installation in tight spaces.

Package Shape or Style: RECTANGULAR

Rectangular shape provides stability and ease of mounting.

Minimum Supply Voltage: 2.5 V

Low minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Output Range: 0-2V

Wide output range offers flexibility in signal processing and interpretation.

Output Type: ANALOG VOLTAGE

Analog voltage output allows for simple interface with other electronic components.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Maximum Operating Current: 3.6 mA

Low operating current consumption promotes energy efficiency and extends battery life.

Body Length/Diameter: 4 mm

Optimal size for accurate magnetic field measurement and efficient usage of space.

Termination Type: SOLDER

Solder termination provides durable and secure connections.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting ensures stable and reliable installation on circuit boards.

Technical Specifications

Magnetic Field Sensors PDRV5053VAQLPG attributes and parameters. Explore more Magnetic Field Sensors devices from Texas Instruments

Specs

Additional Features:

SHORT CIRCUIT PROTECTION

Body Width:

1.52 inch

Body Height:

5.05 mm

Body Length/Diameter:

4 mm

Linearity (%):

1

Mounting Feature:

Maximum Operating Current:

3.6 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Range:

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

38 V

Minimum Supply Voltage:

2.5 V

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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