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PCM4202IDBREP

Texas Instruments

PCM4202IDBREP by Texas Instruments

PCM4202IDBREP by Texas Instruments is a 24-bit ADC with 3.3-5V supplies, 0.216 MHz sample rate, and -40 to 85°C operating temp. Ideal for industrial applications requiring high-resolution analog-to-digital conversion in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,045 parts In-Stock

1+ parts

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4,045

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Digiode

USA . 3,982 parts In-Stock

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3,982

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Distributors (Availability)

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One Stop Electronics

USA . 1,233 parts In-Stock

1+ parts

$2.000

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1,233

$2.000

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Parana Technologies

USA . 1,143 parts In-Stock

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$6.562

100+ parts

-

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$7.304

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1,143

$6.562

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$7.304

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DigiPath Technology Company

USA . 2,106 parts In-Stock

1+ parts

$7.226

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2,106

$7.226

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ChromeModa Solutions

Germany . 5,416 parts In-Stock

1+ parts

$7.373

100+ parts

$6.046

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5,416

$7.373

$6.046

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IDEA Electronic Components Group

UK . 142 parts In-Stock

1+ parts

$7.373

100+ parts

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$6.636

10k+ parts

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142

$7.373

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$6.636

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AZTECH Wire

Italy . 524 parts In-Stock

1+ parts

$16.273

100+ parts

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524

$16.273

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A-Z Elektronik GmbH

Germany . 8,259 parts In-Stock

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Corphita

USA . 675 parts In-Stock

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675

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Kepictronics

USA . 300 parts In-Stock

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300

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Microchip USA

USA . 221 parts In-Stock

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221

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Overview

Unlock the power of high-quality audio with the PCM4202IDBREP by Texas Instruments. Designed for professionals and enthusiasts alike, this Analog-to-Digital Converter boasts unrivaled precision and reliability. With its advanced features and innovative technology, this product ensures exceptional sound quality in a wide range of applications. Experience the superior performance and value that Texas Instruments is known for, and elevate your audio projects to new heights with the PCM4202IDBREP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding much weight.

No. of Bits: 24

Provides high resolution and accuracy in converting analog signals to digital format.

Power Supplies (V): 3.3,5

Supports a range of power supplies, allowing flexibility in different operating conditions.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, ensuring reliability.

Sample Rate: 0.216 MHz

High sample rate allows for fast and accurate conversion of analog signals.

Converter Type: ADC, DELTA-SIGMA

Utilizes advanced Delta-Sigma conversion technology for improved performance and precision.

Nominal Supply Voltage: 5 V

Standard voltage supply makes it compatible with most systems and easy to integrate.

Technical Specifications

Analog-to-Digital Converters PCM4202IDBREP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

24

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Sample Rate:

216 kHz

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-6 V

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

25 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

PCM4202IDBREP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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