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PCM1801UG4

Texas Instruments

PCM1801UG4 by Texas Instruments

PCM1801UG4 by Texas Instruments is a 16-bit ADC with 2 analog input channels, operating b/w -25 to 85°C. It features a sample rate of 0.048 MHz and supports binary output format via serial interface. Ideal for applications requiring precise analog-to-digital conversion in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,460 parts In-Stock

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Vyrian

USA . 4,422 parts In-Stock

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Chip Stock

USA . 3,504 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 77 parts In-Stock

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Cogito LLC

Ukraine . 31 parts In-Stock

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One Stop Electronics

USA . 235 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 627 parts In-Stock

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$11.447

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Parana Technologies

USA . 1,425 parts In-Stock

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$22.436

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$23.106

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ChromeModa Solutions

Germany . 3,931 parts In-Stock

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$25.209

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$20.671

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IDEA Electronic Components Group

UK . 409 parts In-Stock

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$25.209

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$23.949

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$22.688

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409

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A-Z Elektronik GmbH

Germany . 7,179 parts In-Stock

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Corphita

USA . 4,861 parts In-Stock

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Microchip USA

USA . 2,274 parts In-Stock

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DigiPath Technology Company

USA . 194 parts In-Stock

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$22.728

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Perfect Parts

USA . 172 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 77 parts In-Stock

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Overview

Experience top-notch analog-to-digital conversion with the PCM1801UG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications in the electronics industry. The PCM1801UG4 offers customers unparalleled value with its high performance and precision, making it an ideal choice for any project requiring accurate data conversion. Upgrade your design with the PCM1801UG4 and enjoy seamless integration, unmatched efficiency, and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the converter, ensuring reliable performance over time.

No. of Analog In Channels: 2

Having multiple analog input channels allows for more versatile data acquisition and monitoring capabilities.

Surface Mount: YES

Surface mount technology makes installation easier and more efficient, saving time and effort during assembly.

No. of Bits: 16

With a higher number of bits, this converter can provide more precise and accurate digital representations of analog signals.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures that the converter can function effectively in a variety of environmental conditions.

Technology: CMOS

The CMOS technology used in this converter offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature allows for accurate capturing and holding of analog signals at a specific point in time, enabling precise digitization of the input.

Technical Specifications

Analog-to-Digital Converters PCM1801UG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

48 kHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2.828 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

14

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.341 in (8.65 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G14

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

PCM1801UG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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