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PCM1792DBG4

Texas Instruments

PCM1792DBG4 by Texas Instruments

PCM1792DBG4 by Texas Instruments is a 24-bit D/A converter with 3.3-5V power supplies, operating from -25 to 85°C. It features a small outline package and serial input format, making it ideal for audio applications requiring high-resolution digital-to-analog conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,984

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Digiode

USA . 2,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,006

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 517 parts In-Stock

1+ parts

$14.320

100+ parts

-

1k+ parts

$14.770

10k+ parts

-

517

$14.320

-

$14.770

-

AZTECH Wire

Italy . 757 parts In-Stock

1+ parts

$14.698

100+ parts

-

1k+ parts

-

10k+ parts

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757

$14.698

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-

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DigiPath Technology Company

USA . 352 parts In-Stock

1+ parts

$15.768

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$15.768

-

-

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ChromeModa Solutions

Germany . 4,210 parts In-Stock

1+ parts

$16.090

100+ parts

$13.194

1k+ parts

-

10k+ parts

-

4,210

$16.090

$13.194

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-

IDEA Electronic Components Group

UK . 2,200 parts In-Stock

1+ parts

$16.090

100+ parts

$15.286

1k+ parts

$14.481

10k+ parts

-

2,200

$16.090

$15.286

$14.481

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One Stop Electronics

USA . 651 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

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10k+ parts

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651

$22.000

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Corphita

USA . 4,329 parts In-Stock

1+ parts

-

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4,329

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Microchip USA

USA . 967 parts In-Stock

1+ parts

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967

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Overview

Elevate your audio experience with the PCM1792DBG4 by Texas Instruments, a top-of-the-line Digital-to-Analog Converter that delivers unparalleled sound quality and precision. With Texas Instruments' reputation for excellence in manufacturing, this converter is designed to bring out the best in your music, movies, and other digital media. Whether you're a music enthusiast, movie buff, or audiophile, this product offers exceptional value, benefits, and advantages that will take your listening experience to the next level. Experience the difference with the PCM1792DBG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and makes the product lightweight, ideal for portable electronic devices.

No. of Bits: 24

The high resolution of 24 bits ensures accurate and precise conversion of digital signals to analog, resulting in high-quality output.

Power Supplies (V): 3.3,5

The compatibility with multiple power supply voltages of 3.3V and 5V increases flexibility in integrating the product into various systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability even in demanding environmental conditions.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and compatibility with a wide range of devices.

Technical Specifications

Digital-to-Analog Converters PCM1792DBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

Maximum Supply Current:

40 mA

No. of Bits:

24

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Power Supplies:

3.3,5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP28,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

PCM1792DBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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