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PCM1702PG4

Texas Instruments

PCM1702PG4 by Texas Instruments

PCM1702PG4 by Texas Instruments is a 20-bit D/A converter with +-5V power supplies, 0.2us settling time, and BICMOS technology. It is used in applications requiring high precision analog signal conversion, such as audio equipment and instrumentation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,276

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-

-

-

Digiode

USA . 1,846 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,846

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,205 parts In-Stock

1+ parts

$4.516

100+ parts

-

1k+ parts

$4.961

10k+ parts

-

1,205

$4.516

-

$4.961

-

DigiPath Technology Company

USA . 1,418 parts In-Stock

1+ parts

$4.973

100+ parts

-

1k+ parts

-

10k+ parts

-

1,418

$4.973

-

-

-

IDEA Electronic Components Group

UK . 1,586 parts In-Stock

1+ parts

$5.074

100+ parts

-

1k+ parts

$4.567

10k+ parts

-

1,586

$5.074

-

$4.567

-

ChromeModa Solutions

Germany . 40 parts In-Stock

1+ parts

$5.074

100+ parts

$4.161

1k+ parts

-

10k+ parts

-

40

$5.074

$4.161

-

-

AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$19.743

100+ parts

-

1k+ parts

-

10k+ parts

-

872

$19.743

-

-

-

One Stop Electronics

USA . 830 parts In-Stock

1+ parts

$36.000

100+ parts

-

1k+ parts

-

10k+ parts

-

830

$36.000

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-

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Corphita

USA . 1,252 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,252

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Microchip USA

USA . 364 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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364

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Overview

Elevate your audio experience with the PCM1702PG4 by Texas Instruments. This high-quality digital-to-analog converter offers unparalleled precision and clarity, making it a must-have for audiophiles and professionals alike. With Texas Instruments’ reputation for excellence in semiconductor manufacturing, you can trust that this product delivers on its promise of exceptional performance. Whether you’re designing new audio equipment or upgrading existing systems, the PCM1702PG4 provides value, benefits, and advantages that will take your sound quality to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 20

With a high number of bits, this digital-to-analog converter can provide more precise and accurate analog output signals, making it suitable for applications requiring high resolution.

Power Supplies (V): +-5

Having a wide range of power supplies allows for flexibility in different operating conditions, making this product versatile and suitable for various applications.

Nominal Settling Time (tstl): 0.2 us

The fast settling time ensures that the output signal stabilizes quickly, making this digital-to-analog converter suitable for applications that require rapid response and accuracy.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed, low power consumption, and high integration density, making this product efficient and reliable.

Technical Specifications

Digital-to-Analog Converters PCM1702PG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

BICMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

Nominal Settling Time (tstl):

200 ns

No. of Bits:

20

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Power Supplies:

±5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.76 in (19.305 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Trade Compliance

PCM1702PG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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