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DAC7731EB/1KG4

Texas Instruments

DAC7731EB/1KG4 by Texas Instruments

DAC7731EB/1KG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of ±10 V, settling time of 5 us, and linearity error of 0.0061%. Ideal for industrial applications requiring precise analog signal generation. Operates at temperatures from -40 to 85 °C with low supply current of 6 mA.

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 6,860 parts In-Stock

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Digiode

USA . 238 parts In-Stock

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Nova Conductors

Japan . 17 parts In-Stock

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One Stop Electronics

USA . 722 parts In-Stock

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$4.000

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$4.000

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Corohmni

South Africa . 13 parts In-Stock

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$6.130

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Ampacity Inc.

Singapore . 982 parts In-Stock

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$9.000

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$9.000

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AZTECH Wire

Italy . 755 parts In-Stock

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$9.854

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Parana Technologies

USA . 1,519 parts In-Stock

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$12.509

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$12.952

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DigiPath Technology Company

USA . 765 parts In-Stock

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$13.774

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$12.672

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$13.774

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ChromeModa Solutions

Germany . 5,281 parts In-Stock

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$14.055

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$11.525

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IDEA Electronic Components Group

UK . 1,904 parts In-Stock

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$12.650

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Advanced Electronics

New Zealand . 19 parts In-Stock

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$25.642

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Semicontronic

India . 241 parts In-Stock

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Lixinc

USA . 11,705 parts In-Stock

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Continental Prestige Electronics

USA . 5,200 parts In-Stock

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Argo Parts USA

USA . 3,979 parts In-Stock

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Glotronic Ltd.

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the precision and reliability of the DAC7731EB/1KG4 by Texas Instruments, a leading manufacturer in the industry. This Digital-to-Analog Converter offers exceptional quality and performance for a wide range of applications. With a maximum analog output voltage of 10V and high linearity accuracy, this product delivers superior results. Experience the benefits of its compact design, fast settling time, and versatile input format. Trust Texas Instruments to provide cutting-edge solutions that meet your needs with excellence. Elevate your projects with the DAC7731EB/1KG4 today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

High maximum analog output voltage allows for greater flexibility and range in the output signal, making this product suitable for a wide range of applications.

No. of Bits: 16

Having 16 bits allows for higher resolution and precision in converting digital signals to analog, making this product suitable for applications requiring accurate analog outputs.

Maximum Settling Time: 5 us

Fast settling time ensures that the output voltage stabilizes quickly after a change in the input, making this product ideal for time-sensitive applications.

Maximum Linearity Error (EL): 0.0061%

Low linearity error ensures accurate conversion of digital signals to analog, making this product suitable for high-precision applications where accuracy is critical.

Package Style: SMALL OUTLINE, SHRINK PITCH

Compact package size with shrink pitch design saves space on the PCB and makes it suitable for applications where board space is limited.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making this product suitable for industrial applications.

Technical Specifications

Digital-to-Analog Converters DAC7731EB/1KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.0061 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

6 mA

Maximum Settling Time:

5 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5,±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

24

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.323 in (8.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Shrink Pitch

Package Code:

Package Equivalence Code:

SSOP24,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Trade Compliance

DAC7731EB/1KG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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