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PCA9536YZPR

Texas Instruments

PCA9536YZPR by Texas Instruments

PCA9536YZPR by Texas Instruments is a 4-bit parallel I/O port with supply voltage range of 2.3V to 5.5V, ideal for industrial applications. It features CMOS technology, operates b/w -40°C to 85°C, and has a compact package style of grid array with very thin profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,104 parts In-Stock

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5,104

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Digiode

USA . 3,739 parts In-Stock

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3,739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 829 parts In-Stock

1+ parts

$8.073

100+ parts

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829

$8.073

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Parana Technologies

USA . 252 parts In-Stock

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$28.785

100+ parts

-

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$51.811

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252

$28.785

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$51.811

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DigiPath Technology Company

USA . 75 parts In-Stock

1+ parts

$31.696

100+ parts

$29.160

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75

$31.696

$29.160

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ChromeModa Solutions

Germany . 4,885 parts In-Stock

1+ parts

$32.343

100+ parts

$26.521

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4,885

$32.343

$26.521

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IDEA Electronic Components Group

UK . 583 parts In-Stock

1+ parts

$32.343

100+ parts

$30.726

1k+ parts

$29.109

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583

$32.343

$30.726

$29.109

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One Stop Electronics

USA . 372 parts In-Stock

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$33.000

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372

$33.000

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Corohmni

South Africa . 2,958 parts In-Stock

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$61.781

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2,958

$61.781

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Corphita

USA . 2,151 parts In-Stock

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Microchip USA

USA . 121 parts In-Stock

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Overview

Unlock endless possibilities with the PCA9536YZPR by Texas Instruments. This versatile parallel I/O port offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Perfect for a wide range of applications, this product provides seamless integration, efficiency, and value to its users. Experience the benefits of superior performance and functionality with the PCA9536YZPR, setting new standards in the industry. Elevate your projects with this innovative solution today.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient installation on a circuit board, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in powering the device, making it compatible with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the circuit board.

No. of Bits: 4

With 4 bits, this product can handle a moderate amount of data, making it suitable for many applications requiring parallel I/O.

Power Supplies (V): 2.5/5

Supports dual power supply options, giving the user flexibility in choosing the appropriate voltage for their application.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and ensures reliable performance.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The package style allows for high density mounting on the PCB, making it ideal for compact designs.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this product suitable for industrial applications where temperature fluctuations may occur.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure soldering to the PCB.

Maximum Seated Height: 0.5 mm

The low seated height saves space on the PCB and allows for compact designs.

Width: 0.9 mm

The narrow width of this product allows for efficient use of space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product can withstand high-temperature soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures reliable solder joints during manufacturing.

Length: 1.98 mm

The compact length of this product allows for space-saving installation on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

The general-purpose parallel I/O port allows for versatile use in various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy efficient and reliable.

Terminal Form: BALL

The ball terminal form offers secure connections and ease of soldering during assembly.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is commonly used in many electronic devices, ensuring compatibility with existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on the PCB, saving space and enabling compact designs.

No. of I/O Lines: 4

Having 4 I/O lines provides sufficient connectivity for many applications requiring parallel I/O communication.

Technical Specifications

Parallel I/O Ports PCA9536YZPR attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B8

JESD-609 Code:

e1

Length:

1.98 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of I/O Lines:

4

No. of Ports:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.9 mm

Peripheral IC Type:

Trade Compliance

PCA9536YZPR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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