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PCA9698DGG/S911,51

NXP Semiconductors

PCA9698DGG/S911,51 by NXP Semiconductors

NXP Semiconductors' PCA9698DGG/S911,51 is a CMOS technology-based parallel I/O port with 8 I/O lines. It operates at a supply voltage range of 2.3V to 5.5V and can withstand temperatures from -40°C to 85°C. This compact device, measuring 6.1mm in width and 14mm in length, is commonly used for general-purpose applications requiring parallel I/O functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Anansix

USA . 2,812 parts In-Stock

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Vyrian

USA . 1,956 parts In-Stock

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Digiode

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 805 parts In-Stock

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AZTECH Wire

Italy . 239 parts In-Stock

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Semicontronic

India . 870 parts In-Stock

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Corohmni

South Africa . 861 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,650 parts In-Stock

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Advanced Electronics

New Zealand . 75 parts In-Stock

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Corphita

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Microchip USA

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UNI Independent Distributors

Spain . 1,761 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 800 parts In-Stock

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Argo Parts USA

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Overview

Discover the power of innovation with the PCA9698DGG/S911,51 by NXP Semiconductors. As a trusted manufacturer in the industry, NXP delivers top-quality products that are built to last. The PCA9698DGG/S911,51 falls into the category of Parallel I/O Ports, offering endless possibilities for applications. With its compact design and high-performance capabilities, this product is sure to exceed your expectations. Experience the value, benefits, and advantages it brings to your projects, without compromising on quality. Trust NXP Semiconductors for all your electronic needs and unlock the potential of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in reducing the overall weight of the product, making it more portable and convenient to use.

Surface Mount: YES

Surface mount technology allows for easy and quick installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage provides flexibility and compatibility with different power sources, ensuring reliable performance.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and allows for easy integration into various electronic devices and systems.

No. of Terminals: 56

Abundance of terminals allows for greater connectivity options and functionality, suitable for complex applications.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage helps in reducing power consumption and heat generation, improving energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity, corrosion resistance, and durability, ensuring long-lasting performance.

Terminal Position: DUAL

Dual terminal position allows for versatile installation options and flexibility in circuit board design.

No. of Ports: 2

Dual ports offer more connectivity options and allow for simultaneous data transfer, increasing efficiency.

Maximum Seated Height: 1.2 mm

Low profile design with maximum seated height of 1.2 mm enables compact and slim device designs.

Width: 6.1 mm

Narrow width of 6.1 mm saves space on the circuit board, ideal for applications with limited real estate.

Length: 14 mm

Moderate length of 14 mm offers a balance between portability and functionality, suitable for various applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and performance in demanding industrial environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port IC type offers versatility and compatibility with a wide range of devices and systems.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with various voltage levels, ensuring efficient performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and strong mechanical connection, enhancing durability and reliability.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent performance and compatibility with common power sources.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5 mm allows for high-density mounting and precise connections, suitable for compact designs.

No. of I/O Lines: 8

Eight I/O lines provide sufficient input/output options for data transfer and communication, suitable for various applications requiring multiple connections.

Technical Specifications

Parallel I/O Ports PCA9698DGG/S911,51 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

8

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

PCA9698DGG/S911,51 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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