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OPA875IDGKRG4

Texas Instruments

OPA875IDGKRG4 by Texas Instruments

Texas Instruments OPA875IDGKRG4 is a video multiplexer with 2 channels, operating at -40 to 85°C. It has a supply voltage range of 3-6V and offers 70dB off-state isolation. The IC is designed for industrial applications, featuring a small outline package with dual terminals and gull wing form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,598 parts In-Stock

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8,598

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Digiode

USA . 351 parts In-Stock

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351

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,581 parts In-Stock

1+ parts

$3.500

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$3.500

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One Stop Electronics

USA . 388 parts In-Stock

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$7.500

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388

$7.500

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Parana Technologies

USA . 2,310 parts In-Stock

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$8.973

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$9.644

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2,310

$8.973

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$9.644

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DigiPath Technology Company

USA . 472 parts In-Stock

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$9.880

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472

$9.880

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IDEA Electronic Components Group

UK . 1,931 parts In-Stock

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$10.082

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$9.578

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$9.074

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1,931

$10.082

$9.578

$9.074

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ChromeModa Solutions

Germany . 1,012 parts In-Stock

1+ parts

$10.082

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$8.267

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$10.082

$8.267

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AZTECH Wire

Italy . 507 parts In-Stock

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$18.708

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Corphita

USA . 4,977 parts In-Stock

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Argo Parts USA

USA . 4,147 parts In-Stock

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Continental Prestige Electronics

USA . 2,002 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Perfect Parts

USA . 314 parts In-Stock

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Overview

Discover the innovative OPA875IDGKRG4 by Texas Instruments, a top-of-the-line video multiplexer delivering exceptional quality and performance. With a small outline package and industrial-grade temperature range, this switch provides seamless operation in a variety of applications. From automated test equipment to medical imaging systems, the OPA875IDGKRG4 offers reliability and precision like no other. Trust Texas Instruments for cutting-edge technology and elevate your designs with this versatile solution. Unlock endless possibilities with the OPA875IDGKRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it ideal for compact designs.

Package Shape: SQUARE

The square package shape allows for efficient PCB layout and space utilization, making it suitable for tight spaces.

Nominal Supply Voltage (Vsup): 5 V

With a nominal supply voltage of 5V, this product is compatible with standard power sources, ensuring ease of integration.

Power Supplies (V): 5

With support for up to 5 power supplies, this product offers flexibility in power management, enhancing system configuration options.

No. of Terminals: 8

The 8 terminals provide multiple connection points, allowing for versatile connectivity options in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offers a compact form factor without compromising on performance, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function effectively in extreme cold conditions, making it versatile for various operating environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting connections.

Terminal Position: DUAL

The dual terminal position offers redundancy in connections, enhancing reliability and ensuring uninterrupted operation.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this product is compact and suitable for applications with height constraints.

Width (mm): 3 mm

The 3mm width of this product allows for efficient use of space on the PCB, making it suitable for compact designs.

Other IC type: VIDEO MULTIPLEXER

As a video multiplexer, this product is designed specifically for video signal processing applications, ensuring high-quality video output.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V allows for flexibility in power input options, making it compatible with a wide range of power sources.

Minimum Negative Supply Voltage (Vsup): -3 V

Support for negative supply voltage down to -3V enables bidirectional signal processing, enhancing the versatility of this product.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product is easy to solder, speeding up the manufacturing process.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures secure solder joints, enhancing the overall reliability of the product.

Length: 3 mm

The 3mm length of this product helps in optimizing board space, making it suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand harsh operating conditions and is suitable for rugged applications.

Maximum Supply Current (Isup): 12 mA

With a maximum supply current of 12mA, this product offers efficient power consumption, making it energy-efficient.

No. of Channels: 2

Featuring 2 channels, this product can multiplex between different input sources, providing versatility in signal routing options.

Technology: BIPOLAR

The bipolar technology used in this product offers high-speed signal processing capabilities, making it suitable for applications with demanding performance requirements.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and ease of assembly, ensuring reliable performance in various applications.

Maximum Negative Supply Voltage (Vsup): -6 V

Support for negative supply voltage down to -6V allows for bidirectional signal processing, enhancing the versatility of this product.

Nominal Negative Supply Voltage (Vsup): -5 V

The nominal negative supply voltage of -5V ensures compatibility with standard negative power sources, making it easy to integrate into existing setups.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this product offers precise and secure connections, ensuring stable signal transmission.

Moisture Sensitivity Level (MSL): 2

The MSL level of 2 indicates that this product has a moderate level of moisture sensitivity, making it suitable for storage and operation in various environments.

Maximum Supply Voltage (Vsup): 6 V

With support for a maximum supply voltage of 6V, this product can handle varying power input levels, ensuring flexibility in system design.

Nominal Off-state Isolation: 70 dB

The nominal off-state isolation of 70 dB ensures clean signal transmission without interference, making this product ideal for maintaining signal integrity.

Technical Specifications

Multiplexers & Switches OPA875IDGKRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

-3 V

Nominal Negative Supply Voltage (Vsup):

-5 V

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Nominal Off-state Isolation:

70 dB

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

OPA875IDGKRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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