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OPA875ID

Texas Instruments

OPA875ID by Texas Instruments

VIDEO MULTIPLEXER; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$3.950

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$0.556

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$0.556

-

-

-

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$3.950

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$3.950

-

-

-

Rochester

USA . 7,595 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

7,595

-

$3.740

$3.350

$3.150

DigiKey

USA . 7,595 parts In-Stock

1+ parts

-

100+ parts

$4.930

1k+ parts

-

10k+ parts

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7,595

-

$4.930

-

-

Verical

USA . 4,485 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

$3.938

4,485

-

$4.675

$4.188

$3.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,250 parts In-Stock

1+ parts

$0.957

100+ parts

-

1k+ parts

-

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2,250

$0.957

-

-

-

Vyrian

USA . 4,374 parts In-Stock

1+ parts

$1.007

100+ parts

-

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4,374

$1.007

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-

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Microfarads

USA . 5 parts In-Stock

1+ parts

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5

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Bristol Electronics

USA . 5 parts In-Stock

1+ parts

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5

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,063 parts In-Stock

1+ parts

$0.906

100+ parts

-

1k+ parts

-

10k+ parts

-

1,063

$0.906

-

-

-

Parana Technologies

USA . 1,036 parts In-Stock

1+ parts

$14.967

100+ parts

-

1k+ parts

$15.392

10k+ parts

-

1,036

$14.967

-

$15.392

-

DigiPath Technology Company

USA . 384 parts In-Stock

1+ parts

$16.481

100+ parts

$15.162

1k+ parts

-

10k+ parts

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384

$16.481

$15.162

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-

ChromeModa Solutions

Germany . 3,188 parts In-Stock

1+ parts

$16.817

100+ parts

$13.790

1k+ parts

-

10k+ parts

-

3,188

$16.817

$13.790

-

-

IDEA Electronic Components Group

UK . 1,669 parts In-Stock

1+ parts

$16.817

100+ parts

$15.976

1k+ parts

$15.135

10k+ parts

-

1,669

$16.817

$15.976

$15.135

-

Microchip USA

USA . 2,390 parts In-Stock

1+ parts

$21.190

100+ parts

$21.060

1k+ parts

$20.990

10k+ parts

$20.930

2,390

$21.190

$21.060

$20.990

$20.930

iodParts Technologies Inc.

India . 36,716 parts In-Stock

1+ parts

-

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36,716

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Perfect Parts

USA . 734 parts In-Stock

1+ parts

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734

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Technical Specifications

Multiplexers & Switches OPA875ID attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

-3 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Normal Position (V):

NO/NC

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Nominal Off-state Isolation:

70 dB

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

OPA875ID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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