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OPA4872IDRG4

Texas Instruments

OPA4872IDRG4 by Texas Instruments

OPA4872IDRG4 by Texas Instruments is a dual-terminal, single-ended multiplexer with 14 terminals and a small outline package. It operates at temperatures ranging from -40 to 85 °C and has a max supply current of 11.7 mA. Ideal for industrial applications requiring high off-state isolation and bipolar technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,188 parts In-Stock

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Vyrian

USA . 2,589 parts In-Stock

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Nova Conductors

Japan . 81 parts In-Stock

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Parana Technologies

USA . 133 parts In-Stock

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$1.655

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$2.267

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133

$1.655

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$2.267

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DigiPath Technology Company

USA . 1,996 parts In-Stock

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$1.823

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$1.677

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$1.823

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IDEA Electronic Components Group

UK . 765 parts In-Stock

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$1.860

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$1.674

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765

$1.860

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$1.674

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ChromeModa Solutions

Germany . 763 parts In-Stock

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$1.860

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$1.525

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763

$1.860

$1.525

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Ampacity Inc.

Singapore . 705 parts In-Stock

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$4.500

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705

$4.500

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One Stop Electronics

USA . 325 parts In-Stock

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$6.500

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325

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AZTECH Wire

Italy . 649 parts In-Stock

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$16.228

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Continental Prestige Electronics

USA . 5,826 parts In-Stock

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Corphita

USA . 4,215 parts In-Stock

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Argo Parts USA

USA . 2,831 parts In-Stock

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Perfect Parts

USA . 430 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the superior performance and reliability of the OPA4872IDRG4 by Texas Instruments, a leading manufacturer in the industry. This versatile multiplexer offers exceptional quality and precision for a wide range of applications. With its compact design and advanced technology, this product provides unmatched value and benefits to customers seeking a reliable solution for their systems. Trust in Texas Instruments to deliver excellence with the OPA4872IDRG4, setting new standards in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer, ensuring long-lasting performance.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is commonly used and easily accessible, making this multiplexer compatible with a wide range of systems.

No. of Terminals: 14

With 14 terminals, this multiplexer can support multiple input and output connections, allowing for versatile signal routing options.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in hot environments, making this multiplexer suitable for industrial applications.

Technology: BIPOLAR

The bipolar technology used in this multiplexer provides fast switching speeds and low power consumption, enhancing overall performance.

Technical Specifications

Multiplexers & Switches OPA4872IDRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

2

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

-3.5 V

Nominal Negative Supply Voltage (Vsup):

-5 V

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Nominal Off-state Isolation:

88 dB

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

11.7 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

3.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

OPA4872IDRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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